1,2,3,4,5,6-hexakis(2-cyanoethoxy)hexane | 2465-92-1

• 物质功能分类: 有机原料 - 腈类化合物
• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 1,2,3,4,5,6-hexakis(2-cyanoethoxy)hexane
• 英文别名: hexakis-O-(2-cyano-ethyl)-glucitol；1.2.3.4.5.6-Hexakis-(2-cyan-aethoxy)-hexan；Hexakis-O-(2-cyan-aethyl)-glucit；1,2,3,4,5,6-hexakis-O-(2-cyanoethyl)hexitol；3-[2,3,4,5,6-pentakis(2-cyanoethoxy)hexoxy]propanenitrile
• CAS: 2465-92-1
• 化学式: C₂₄H₃₂N₆O₆
• 分子量: 500.555
• InChiKey: SIPCQLNTTKBLSF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  -2.3
• 重原子数：
  36
• 可旋转键数：
  23
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.75
• 拓扑面积：
  198
• 氢给体数：
  0
• 氢受体数：
  12

反应信息

• 作为反应物：
  描述：

  1,2,3,4,5,6-hexakis(2-cyanoethoxy)hexane 在 sodium azide 、 氯化铵 作用下， 以 N,N-二甲基甲酰胺 为溶剂， 反应 24.0h， 以97%的产率得到1,2,3,4,5,6-hexakis[2-(1H-tetrazol-5-yl)ethoxy]hexane
  参考文献：
  名称：

  Synthesis of polynuclear azoles linked by ether tethers

  摘要：

  Alkylation of NH-triazoles and tetrazoles and cycloaddition of organic and inorganic azides to propargyl ethers bearing a cyano group gave a number of polynuclear heterocyclic systems bridged by ether tethers. DOI: 10.1134/S1070428013010223

  DOI：

  10.1134/s1070428013010223
• 作为产物：
  描述：

  山梨醇 、 丙烯腈 在 sodium hydroxide 作用下， 生成 1,2,3,4,5,6-hexakis(2-cyanoethoxy)hexane
  参考文献：
  名称：

  Esters of poly-beta-carboxyalkyl ethers of polyhydric alcohols

  摘要：

  公开号：

  US02372808A1

文献信息

• STABILIZATION OF HYDROXYLAMINE CONTAINING SOLUTIONS AND METHOD FOR THEIR PREPARATION
  申请人：Lee Wai Mun

  公开号：US20090112024A1

  公开（公告）日：2009-04-30

  The invention relates to the use of amidoximes for prevention of or stabilization of hydroxylamine compounds against undesired decomposition.

  本发明涉及将酰胺肟用于预防或稳定羟基胺化合物，防止其不受控分解。
• CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE
  申请人：Lee Wai Mun

  公开号：US20090130849A1

  公开（公告）日：2009-05-21

  A composition and associated method for chemical mechanical planarization (or other polishing) is described. The composition contains an amidoxime compound and water. The composition may also contain an abrasive and a compound with oxidation and reduction potential. The composition is useful for attaining improved removal rates for metal, including copper, barrier material, and dielectric layer materials in metal CMP. The composition is particularly useful in conjunction with the associated method for metal CMP applications.

  本文描述了一种化学机械平整化（或其他抛光）的组合物及其相关方法。该组合物含有一种酰胺肟化合物和水。该组合物还可以含有磨料和具有氧化还原潜力的化合物。该组合物可用于在金属CMP中获得改进的金属去除速率，包括铜、屏障材料和金属CMP中的介电层材料。该组合物在金属CMP应用的相关方法中特别有用。
• PROCESS OF PURIFICATION OF AMIDOXIME CONTAINING CLEANING SOLUTIONS AND THEIR USE
  申请人：Lee Wai Mun

  公开号：US20100105594A1

  公开（公告）日：2010-04-29

  The invention relates to processes for producing and using amidoxime compounds with low trace metal impurities. The invention further relates to compositions comprising amidoxime compounds with low trace metal impurities, such compositions useful for cleaning or removing residues from semiconductor substrates and/or equipment.

  本发明涉及生产和使用低微量金属杂质的酰胺肟化合物的方法。本发明还涉及包含低微量金属杂质的酰胺肟化合物的组合物，这种组合物可用于清洁或去除半导体基板和/或设备中的残留物。
• NOVEL NITRILE AND AMIDOXIME COMPOUNDS AND METHODS OF PREPARATION FOR SEMICONDUCTOR PROCESSING
  申请人：Lee Wai Mun

  公开号：US20130035272A1

  公开（公告）日：2013-02-07

  Semiconductor processing compositions comprising amidoxime compounds having two or more amidoxime functional groups and their use in semiconductor processing to remove photoresist, polymeric materials, etching residues and copper oxides from semiconductor substrates, particularly substrates comprising copper, low-k dielectric material, titanium nitride, and/or titanium oxynitride.

  半导体加工组合物包括具有两个或更多酰肟官能团的酰肟官能化合物，以及它们在半导体加工中的使用，用于从半导体基板中去除光阻、聚合物材料、蚀刻残留物和铜氧化物，特别是包括铜、低介电常数材料、氮化钛和/或氧化氮化钛的基板。
• COPPER CMP POLISHING PAD CLEANING COMPOSITION COMPRISING OF AMIDOXIME COMPOUNDS
  申请人：Lee Wai Mun

  公开号：US20090137191A1

  公开（公告）日：2009-05-28

  The present invention relates to methods of using amidoxime compositions for cleaning polishing pads, particularly after chemical mechanical planarization or polishing is provided. A polishing pad is cleaned of Cu CMP by-products, subsequent to or during planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising an aqueous amidoxime compound solution in water.

  本发明涉及使用氨基甲酰肼组合物清洁抛光垫的方法，特别是在化学机械平面化或抛光后提供的方法。在平面化晶片的过程中或之后，通过在抛光垫表面涂布含有水的氨基甲酰肼化合物溶液的组合物，清除铜化学机械抛光副产物，以减少垫面光泽。

表征谱图