Low dielectric resin composition with phosphorus-containing flame retardant and preparation method and application thereof
申请人:Elite Electronic Material (Zhong Shan) Co., Ltd.
公开号:US09867287B2
公开(公告)日:2018-01-09
The invention belongs to the technical field of low dielectric resin compositions, and discloses a low dielectric resin composition with phosphorus-containing flame retardant and a prepreg, resin film, laminate and printed circuit board prepared therefrom. The composition comprises the following components: (A) phosphorus-containing flame retardant; (B) vinyl compound. The phosphorus-containing flame retardant has a structure as shown in formula (I).
In the present invention, diphenylphosphine oxide is derivatized, and prepared a phosphorus-containing flame retardant, which has no reactive functional groups, has better dielectric properties, and has high melting point, and upon combining with a vinyl compound, a resin composition is obtained, and a laminate having low thermal expansion ratio, high heat resistance, high glass transition temperature, and low dielectric constant and dissipation factor, can be made from the resin composition, and can effectively achieve the flame resistance effect of UL94 V-0 without using halogen-containing flame retardant, and can be used in the preparation of prepregs, resin films, resin coated coppers, flexible resin coated coppers, laminates and printed circuit boards.
本发明属于低介电树脂组合物技术领域,公开了一种含磷阻燃剂的低介电树脂组合物及其预浸料、树脂膜、层压板和印刷电路板。该组合物包括以下组分:(A) 含磷阻燃剂;(B) 乙烯化合物。所述含磷阻燃剂的结构如公式(I)所示。在本发明中,二苯基氧化膦经过衍生化,制备出一种不含反应性官能团的含磷阻燃剂,具有更好的介电性能和高熔点,在与乙烯化合物结合后,得到一种树脂组合物,可以制备出具有低热膨胀比、高耐热性、高玻璃化转变温度、低介电常数和介质损耗因子的层压板,且可以有效地实现UL94 V-0的阻燃效果,而不使用含卤阻燃剂,可用于预浸料、树脂膜、树脂涂铜、柔性树脂涂铜、层压板和印刷电路板的制备。