The present invention relates to compounds according to formula (I) and to heat-curable resin compositions based on polymaleimide resin systems comprising such compounds as co-monomers:, (I) wherein Dis an x-functional group; and x is an integer ≥ 2; with the proviso that the x-functional group D is not a polycarbonate with an average molar mass in the range of 15000 g/mol to 150000 g/mol. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.
本发明涉及按照式(I)的化合物以及基于聚马来
酰亚胺树脂体系的热固性
树脂组合物,其中这些化合物作为共聚单体:(I)其中D是一个x官能团;x是大于等于2的整数;但需注意x官能团D不是具有平均摩尔质量在15000克/摩尔至150000克/摩尔范围内的聚
碳酸酯。本发明还涉及通过固化这些组合物获得的交联
树脂。本发明的化合物可以在结构胶、纤维预浸料的基体
树脂、成型复合材料以及结构和/或电气复合材料等领域中使用。