HIGH TEMPERATURE MATERIAL COMPOSITIONS FOR HIGH TEMPERATURE THERMAL CUTOFF DEVICES
申请人:Kent Perry
公开号:US20120121795A1
公开(公告)日:2012-05-17
The present disclosure provides a high-temperature thermal pellet composition that maintains structural rigidity up to a transition temperature of about 240° C. The composition comprises at least one organic compound (e.g., triptycene or 1-aminoanthroquinone). The pellet can be disposed in a housing of a thermally-actuated, current cutoff device, such as a high-temperature thermal cutoff device (HTTCO). Also provided are material systems, which include the pellet composition and a high-temperature seal that provides substantial sealing up to at least the transition temperature. Methods of making such high-temperature pellet compositions and incorporating them into a thermally-actuated, current cutoff device are also provided.
US8961832B2
申请人:——
公开号:US8961832B2
公开(公告)日:2015-02-24
Sengupta, Pasupati; Ghosh, Shyamal K.; Das, Saktipada, Journal of the Indian Chemical Society, 1997, vol. 74, # 11-12, p. 827 - 830