Mixtures of 1-isopropyl-2-aryl imidazole and 1-isopropyl-2-aryl imidazoline as epoxy resin curative compositions
申请人:TEXACO CHEMICAL COMPANY
公开号:EP0501074A1
公开(公告)日:1992-09-02
A mixture of 1-isopropyl-2-aryl imidazole and 1-isopropyl-2-aryl imidazoline, in which from 5 to 50% of mixture is 1-isopropyl-2-aryl imidazoline, is an effective curative composition for epoxy resins.
ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING THE SAME
申请人:LEE Jun Woo
公开号:US20140194555A1
公开(公告)日:2014-07-10
An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof.