An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one RAFT compound as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.
一种用于制造印刷电路板的焊接掩模的喷墨方法使用一种焊接掩模喷墨墨
水,该墨
水含有至少一种光
引发剂、至少一种可自由基聚合的化合物和至少一种作为附着力
促进剂的 RAFT 化合物。生产出的高质量阻焊层既能承受焊接过程中的高热应力,又能保持良好的物理特性。