The present invention relates to compounds of the formula (I) and to the use thereof in organic electronic devices, and to organic electronic devices which comprise compounds of the formula (I), preferably as hole-transport materials and/or as matrix materials, in particular in combination with a further matrix material.
[DE] VERBINDUNGEN FÜR ELEKTRONISCHE VORRICHTUNGEN<br/>[EN] COMPOUNDS FOR ELECTRONIC DEVICES<br/>[FR] COMPOSÉS POUR DISPOSITIFS ÉLECTRONIQUES
申请人:MERCK PATENT GMBH
公开号:WO2011088877A1
公开(公告)日:2011-07-28
Die vorliegende Erfindung betrifft Verbindungen gemäß Formel (I) und deren Verwendung in organischen elektronischen Vorrichtungen sowie organische elektronische Vorrichtungen, welche Verbindungen gemäß Formel (I) enthalten, bevorzugt als Lochtransportmaterialien und/oder als Matrixmaterialien, insbesondere in Kombination mit einem weiteren Matrixmaterial.
COMPOUNDS FOR ELECTRONIC DEVICES
申请人:Parham Amir Hossain
公开号:US20120292576A1
公开(公告)日:2012-11-22
The present invention relates to compounds of the formula (I) and to the use thereof in organic electronic devices, and to organic electronic devices which comprise compounds of the formula (I), preferably as hole-transport materials and/or as matrix materials, in particular in combination with a further matrix material.