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8,8-Dimethyl-3-oxatricyclo<4.1.1.02,4>octan | 90582-90-4

中文名称
——
中文别名
——
英文名称
8,8-Dimethyl-3-oxatricyclo<4.1.1.02,4>octan
英文别名
7,7-Dimethyl-3-oxatricyclo[4.1.1.02,4]octane
8,8-Dimethyl-3-oxatricyclo<4.1.1.0<sup>2,4</sup>>octan化学式
CAS
90582-90-4
化学式
C9H14O
mdl
——
分子量
138.21
InChiKey
JOKAISCMWFTWMA-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

物化性质

  • 沸点:
    177.9±8.0 °C(Predicted)
  • 密度:
    1.035±0.06 g/cm3(Predicted)

计算性质

  • 辛醇/水分配系数(LogP):
    2
  • 重原子数:
    10
  • 可旋转键数:
    0
  • 环数:
    4.0
  • sp3杂化的碳原子比例:
    1.0
  • 拓扑面积:
    12.5
  • 氢给体数:
    0
  • 氢受体数:
    1

反应信息

  • 作为反应物:
    描述:
    8,8-Dimethyl-3-oxatricyclo<4.1.1.02,4>octan 在 zinc dibromide 作用下, 以 为溶剂, 生成 fencholenic aldehyde
    参考文献:
    名称:
    Dulou,R. et al., Comptes Rendus Hebdomadaires des Seances de l'Academie des Sciences, 1962, vol. 254, p. 3374 - 3375
    摘要:
    DOI:
  • 作为产物:
    描述:
    (1S,5R)-6,6-dimethylbicyclo[3.1.1]hept-2-ene 、 间氯过氧苯甲酸 以88%的产率得到
    参考文献:
    名称:
    LIGHTNER, D. A.;CRIST, B. V., TETRAHEDRON, 1985, 41, N 15, 3021-3028
    摘要:
    DOI:
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文献信息

  • Efficient ring opening of epoxides with trimethylsilyl azide and cyanide catalyzed by erbium(III) triflate
    作者:Antonio Procopio、Paola Costanzo、Renato Dalpozzo、Loredana Maiuolo、Monica Nardi、Manuela Oliverio
    DOI:10.1016/j.tetlet.2010.07.123
    日期:2010.9
    Epoxides can be opened under neutral conditions with TMSN3 and TMSCN in the presence of catalytic amounts of Lewis acid, affording the corresponding ring-opened compounds in high yields.
    可以在催化量的路易斯酸存在下,在中性条件下用TMSN 3和TMSCN开环氧化物,从而以高收率得到相应的开环化合物。
  • RADIATION- OR THERMALLY-CURABLE BARRIER SEALANTS
    申请人:Kong Shengqian
    公开号:US20100164368A1
    公开(公告)日:2010-07-01
    This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.
    本发明涉及可固化密封剂,其在固化后提供低水分透过率和良好的粘接强度。该组分包括具有间位取代反应基团的芳香化合物和阳离子或自由基引发剂。
  • Heat-curable hybrid epoxy functional composition and transparent heat-cured caustic-resistant coatings prepared therefrom
    申请人:Essilor International
    公开号:US11242431B2
    公开(公告)日:2022-02-08
    The present invention relates to a heat-curable composition comprising at least one epoxy monomer comprising two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, and at least one epoxy ring-opening catalyst. The composition comprises at least 50% by weight of compounds having at least one epoxy group, relative to the total weight of polymerizable compounds present in the composition and provides upon pre-curing a tack-free coating that can be removed by treatment with a solution of sodium hydroxide, and upon post-curing a coating that cannot be removed by treatment with a solution of sodium hydroxide.
    本发明涉及一种热固化组合物,该组合物包含至少一种含有两个或三个环氧基团的环氧单体,该单体不是可水解聚合的硅化合物;至少一种含有至少一个硅原子的环氧化合物,该硅原子上直接连接有至少一个可水解基团和至少一个环氧基团;以及至少一种环氧开环催化剂。相对于组合物中可聚合化合物的总重量,组合物中至少含有 50%(按重量计)具有至少一个环氧基团的化合物,并且在预固化时可提供无粘性涂层,该涂层可通过氢氧化钠溶液的处理去除,在后固化时可提供无法通过氢氧化钠溶液的处理去除的涂层。
  • RADIATION-OR THERMALLY-CURABLE OXETANE BARRIER SEALANTS
    申请人:Kong Shengqian
    公开号:US20080296159A1
    公开(公告)日:2008-12-04
    This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.
  • Heat-Curable Hybrid Epoxy Functional Composition and Transparent Heat-Cured Caustic-Resistant Coatings Prepared Therefrom
    申请人:Essilor International
    公开号:US20190345286A1
    公开(公告)日:2019-11-14
    The present invention relates to a heat-curable composition comprising at least one epoxy monomer comprising two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, and at least one epoxy ring-opening catalyst. The composition comprises at least 50% by weight of compounds having at least one epoxy group, relative to the total weight of polymerizable compounds present in the composition and provides upon pre-curing a tack-free coating that can be removed by treatment with a solution of sodium hydroxide, and upon post-curing a coating that cannot be removed by treatment with a solution of sodium hydroxide.
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