申请人:E. I. du Pont de Nemours and Company
公开号:US07399887B1
公开(公告)日:2008-07-15
A compound comprising Formula I, or a mixture thereof,
wherein
Y is a bond or CmH2m−p(OA)p wherein m is 0 to 4, and p is 0 or 1,
X′ is X or H,
X is CH2CH2OA, CH(CH2OA)2, C(CH2OA)3, or
X and X′ combine to form (CH2CH2)2NCH2CH2OA or (CH2CH2)2O, provided that when X and X′ combine to form (CH2CH2)2O then Y is CH2CH(OA)CH2,
A is CF2CFHO—Rf or H,
Rf is CnF2n+1 wherein n is an integer of 1 to about 6,
M is a cation having a charge equal to a, and
a is a positive integer equal to 1 or 2,
provided that at least one of X, X′, or Y contains A equal to CF2CFHO—Rf,
and its use in lowering surface tension and imparting improved surface effects.
一种化合物,包括式I或其混合物,其中:
Y为键合或CmH2m−p(OA)p,其中m为0到4,p为0或1,
X'为X或H,
X为CH2CH2OA,CH(CH2OA)2,C(CH2OA)3,或X和X'结合形成(CH2CH2)2NCH2CH2OA或(CH2CH2)2O,但当X和X'结合形成(CH2CH2)2O时,Y为CH2CH(OA)CH2,
A为CF2CFHO—Rf或H,
Rf为CnF2n+1,其中n为1到约6的整数,
M为带有等于a的电荷的阳离子,
a为1或2的正整数,
前提是X、X'或Y中至少有一个含有等于CF2CFHO—Rf的A,
并且在降低表面张力和赋予改善的表面效果中使用。