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2-(4-tert-Butylphenyl)-3-methyl-2-butanol

中文名称
——
中文别名
——
英文名称
2-(4-tert-Butylphenyl)-3-methyl-2-butanol
英文别名
2-(4-Butan-2-ylphenyl)-3-methylbutan-2-ol;2-(4-butan-2-ylphenyl)-3-methylbutan-2-ol
2-(4-tert-Butylphenyl)-3-methyl-2-butanol化学式
CAS
——
化学式
C15H24O
mdl
——
分子量
220.355
InChiKey
WMSYYIQVBOSIFP-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    4.3
  • 重原子数:
    16
  • 可旋转键数:
    4
  • 环数:
    1.0
  • sp3杂化的碳原子比例:
    0.6
  • 拓扑面积:
    20.2
  • 氢给体数:
    1
  • 氢受体数:
    1

反应信息

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文献信息

  • CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION AND RESIST PATTERN FORMING PROCESS
    申请人:Shin-Etsu Chemical Co., Ltd.
    公开号:US20180180998A1
    公开(公告)日:2018-06-28
    A negative resist composition comprising a sulfonium compound having formula (A) and a base polymer is provided. The resist composition exhibits a high resolution during pattern formation and forms a pattern with minimal LER.
    提供一种负型光刻胶组合物,包括具有公式(A)的磺化物化合物和基础聚合物。该光刻胶组合物在图案形成期间表现出高分辨率,并形成具有最小LER的图案。
  • SHRINK MATERIAL AND PATTERN FORMING PROCESS
    申请人:Shin-Etsu Chemical Co., Ltd.
    公开号:US20160161851A1
    公开(公告)日:2016-06-09
    A shrink material is provided comprising a polymer comprising recurring units of formula (1) and a solvent containing an anti-vanishing solvent. A pattern is formed by applying a resist composition comprising a base resin and an acid generator onto a substrate to form a resist film, exposing, developing in an organic solvent developer to form a negative resist pattern, applying the shrink material onto the pattern, and removing the excessive shrink material with an organic solvent for thereby shrinking the size of holes and/or slits in the pattern.
  • SILICON-CONTAINING POLYMER, SILICON-CONTAINING COMPOUND, COMPOSITION FOR FORMING A RESIST UNDER LAYER FILM, AND PATTERNING PROCESS
    申请人:SHIN-ETSU CHEMICAL CO., LTD.
    公开号:US20160229939A1
    公开(公告)日:2016-08-11
    The present invention provides a silicon-containing polymer which contains a repeating unit shown by the general formula (1-3) and one or more repeating units selected from repeating units shown by the general formulae (1-1) and (1-2) as a partial structure. There can be provided a composition for forming a silicon-containing resist under layer film, and a silicon-containing polymer and a silicon-containing compound to give the composition that is capable of forming a resist under layer film improved in adhesiveness in any resist pattern, regardless of negative development or positive development.
  • NEGATIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS
    申请人:Shin-Etsu Chemical Co., Ltd.
    公开号:US20160299430A1
    公开(公告)日:2016-10-13
    A negative resist composition is provided comprising (A) a polymer comprising recurring units having an acid-eliminatable group and recurring units capable of generating acid upon exposure and (B) a carboxylic acid onium salt. When the negative resist composition is processed by the microprocessing technology, especially EB lithography, it forms a pattern having a very high resolution and minimal LER.
  • PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ACTIVE-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM AND MASK BLANK
    申请人:FUJIFILM Corporation
    公开号:US20170121437A1
    公开(公告)日:2017-05-04
    A pattern forming method includes forming a film using an actinic ray-sensitive or radiation-sensitive resin composition, exposing the film with active light or radiation, and developing the exposed film using a developer including an organic solvent, in which the actinic ray-sensitive or radiation-sensitive resin composition contains a compound having a partial structure represented by General Formula (I).
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