Window member for chemical mechanical polishing and polishing pad
申请人:JSR Corporation
公开号:EP1306163A1
公开(公告)日:2003-05-02
An object of the present invention is to provide a window member (12) for chemical mechanical polishing, which is excellent in antifouling property and transparency and is excellent in anti-scratching and, further, can easily perform detection of a polishing endpoint of the surface of a semiconductor wafer (4) by passing a light for endpoint detection, in polishing of a semiconductor wafer (4) using an optical endpoint detecting apparatus (6) and also to a polishing pad (1). A window member (12) for chemical mechanical polishing of the present invention is provided with a substrate part (12a) (comprised of polyurethane resin and the like), which is transparent partly at least, an antifouling resin layer (12b) formed on at least one side of the substrate part (12a). This antifouling resin layer (12b) is preferably comprised of a fluorine-based polymer having a polysiloxane segment in a main chain.
An object of the invention is to provide an electrode catalyst layer of a solid polymer electrolyte membrane-electrode assembly expressing excellent balance between water retention and drainage in an electrode, good power generation performance under any of low humidity and high humidity conditions, and also excellent durability of power generation.
The electrode catalyst layer of the invention contains catalyst particles, an ion exchange resin and a water repellent agent, wherein said water repellent agent contains at least one kind selected from the group consisting of (A) a fluorine-containing copolymer having a structure unit derived from a polyfluoroalkyl-containing (meth)acrylate and (B) a fluorine-containing copolymer having a specific structure unit derived from a fluorine-containing olefin monomer and a specific structure unit derived from a vinyl ether monomer.
A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises a substrate, an organic membrane formed on the substrate, and a metal wire formed on the organic membrane. An arithmetic mean deviation Ra of the profile of the surface of the organic membrane where the metal wire is formed is not less than 60 nm and not more than 5×10
−2
D, where D is the width of the metal wire. The contact angle with respect to water on the surface of the organic membrane where the metal wire is formed is not less than 110°.
提供了一种基底,使用金属微粒的分散液可以在其上令人满意地形成导线,而不会导致断开或短路。布线基板包括基底、在基底上形成的有机膜和在有机膜上形成的金属丝。形成金属丝的有机膜表面轮廓的算术平均偏差 Ra 不小于 60 nm,不大于 5×10
-2
D,其中 D 是金属丝的宽度。形成金属丝的有机膜表面与水的接触角不小于 110°。
Olefin polymer, process for manufacturing the same, curable resin composition, and antireflection coating