A substrate is provided on which wires can be formed satisfactorily using a dispersion liquid of metal microparticles without causing disconnection or short circuit. The wiring substrate comprises a substrate, an organic membrane formed on the substrate, and a metal wire formed on the organic membrane. An arithmetic mean deviation Ra of the profile of the surface of the organic membrane where the metal wire is formed is not less than 60 nm and not more than 5×10
−2
D, where D is the width of the metal wire. The contact angle with respect to water on the surface of the organic membrane where the metal wire is formed is not less than 110°.
提供了一种基底,使用
金属微粒的分散液可以在其上令人满意地形成导线,而不会导致断开或短路。布线基板包括基底、在基底上形成的有机膜和在有机膜上形成的
金属丝。形成
金属丝的有机膜表面轮廓的算术平均偏差 Ra 不小于 60 nm,不大于 5×10
-2
D,其中 D 是
金属丝的宽度。形成
金属丝的有机膜表面与
水的接触角不小于 110°。