The present invention relates to a heat-curable composition comprising at least one epoxy monomer comprising two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, and at least one epoxy ring-opening catalyst. The composition comprises at least 50% by weight of compounds having at least one epoxy group, relative to the total weight of polymerizable compounds present in the composition and provides upon pre-curing a tack-free coating that can be removed by treatment with a solution of sodium hydroxide, and upon post-curing a coating that cannot be removed by treatment with a solution of sodium hydroxide.
本发明涉及一种热固化组合物,该组合物包含至少一种含有两个或三个环氧基团的环氧单体,该单体不是可
水解聚合的
硅化合物;至少一种含有至少一个
硅原子的环氧化合物,该
硅原子上直接连接有至少一个可
水解基团和至少一个环氧基团;以及至少一种环氧开环催化剂。相对于组合物中可聚合化合物的总重量,组合物中至少含有 50%(按重量计)具有至少一个环氧基团的化合物,并且在预固化时可提供无粘性涂层,该涂层可通过
氢氧化钠溶液的处理去除,在后固化时可提供无法通过
氢氧化钠溶液的处理去除的涂层。