An ultra-thin metal-loaded polymer film on the order of about 500 Å to 1000 Å (50 nm to 100 nm) thick cannot be made using metal particles as the filler material, because even at their lowest values the sizes of the particles are greater than the film thickness. In the invention process, a metal-organic compound (MOC) is used in lieu of particles. An oriented polymer/MOC film is prepared by dissolving both the polymer and the MOC sequentially in the same solvent to obtain an emulsion consisting of a discontinuous phase of finite globules of the MOC solution dispersed in a continuous phase of the polymer solution, forming the emulsion into a film, and orienting the film, while the solvent evaporates, to attain a desired arrangement of the MOC phase in the film while the polymer crystallizes. Such films are useful in various applications, e.g., as dielectrics for capacitors.
使用
金属微粒作为填充材料无法制成厚度约为 500 Å 至 1000 Å(50 nm 至 100 nm)的超薄
金属负载聚合物薄膜,因为即使在最低值时,微粒的尺寸也大于薄膜的厚度。在本发明的工艺中,使用
金属有机化合物(MOC)代替颗粒。制备定向聚合物/MOC 薄膜的方法是:将聚合物和 MOC 依次溶解在相同的溶剂中,以获得一种乳液,该乳液由分散在聚合物溶液连续相中的 MOC 溶液有限球状物的不连续相组成,将乳液形成薄膜,并在溶剂蒸发的同时使薄膜定向,以达到 MOC 相在薄膜中的理想排列,同时聚合物结晶。这种薄膜有多种用途,例如用作电容器的电介质。