An objective of the present invention is to provide a curable silicone composition of the present invention exhibiting superior adhesive properties with respect to a poor-adhesive resin such as PPS, even if the composition is cured at a relatively low temperature for a short period. The aforementioned objective of the present invention is achieved by a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, (C) a hydrosilylation-reaction catalyst, and (D) an acid anhydride having an alkoxy group bonding to a silicon atom or an alkoxyalkoxy group bonding to a silicon atom.
本发明的目标是提供一种可治愈的
硅氧烷组合物,即使在相对较低的温度下短时间内治愈,也能表现出对于不良粘附
树脂(如PPS)的优越粘附性能。本发明的上述目标通过包括以下成分的可治愈的
硅氧烷组合物来实现:(A)分子中至少具有两个烯基基团的有机聚
硅氧烷,(B)分子中至少具有两个
硅键合氢原子的有机聚
硅氧烷,(C)氢
硅烷基化反应催化剂,以及(D)酸酐,其具有与
硅原子键合的烷氧基或烷氧基烷氧基。