(E)-1,3-bis(4-(diethylamino)phenyl)prop-2-en-1-one

• 分子结构分类: 有机化合物 - 苯丙烷和聚酮 - 直链 1,3-二芳基丙烷
• 英文名称: (E)-1,3-bis(4-(diethylamino)phenyl)prop-2-en-1-one
• 英文别名: (E)-1,3-bis[4-(diethylamino)phenyl]prop-2-en-1-one
• 化学式: C₂₃H₃₀N₂O
• 分子量: 350.504
• InChiKey: FJLAFBORFDOARE-WOJGMQOQSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  5.4
• 重原子数：
  26
• 可旋转键数：
  9
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.35
• 拓扑面积：
  23.6
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为反应物：
  描述：

  (E)-1,3-bis(4-(diethylamino)phenyl)prop-2-en-1-one 在 四氢吡咯 、 三氟化硼乙醚 、 乙酸酐 、 溶剂黄146 、 三乙胺 作用下， 以 四氢呋喃 、 苯 为溶剂， 反应 31.08h， 生成 (E)-7-((E)-3-(2,4-bis(4-(diethylamino)phenyl)-5,6-dihydrocyclopenta[b]thiopyran-7-yl)allylidene)-2,4-bis(4-(diethylamino)phenyl)-6,7-dihydro-5H-cyclopenta[b]thiopyran-1-ium tetrafluoroborate
  参考文献：
  名称：

  Rational Design of Asymmetric Polymethines to Attain NIR(II) Bioimaging at >1100 nm

  摘要：

  DOI：

  10.1021/jacs.2c10860
• 作为产物：
  描述：

  对二乙氨基苯乙酮 、 N,N-二乙基-4-氨基苯甲醛 在 potassium hydroxide 作用下， 以 甲醇 为溶剂， 以68 %的产率得到(E)-1,3-bis(4-(diethylamino)phenyl)prop-2-en-1-one
  参考文献：
  名称：

  Rational Design of Asymmetric Polymethines to Attain NIR(II) Bioimaging at >1100 nm

  摘要：

  DOI：

  10.1021/jacs.2c10860

文献信息

• Curable composition
  申请人：Asahi Kasei Kogyo Kabushiki Kaisha

  公开号：EP0203393A1

  公开（公告）日：1986-12-03

  A curable composition comprising (a) a curable polyimide soluble in organic solvents and (b) a polymerization initiator as essential components, said polyimide consisting of recurring units represented by the formula wherein, each of X, X1, X2, X3 and X4 is a tetravalent carbocyclic or heterocyclic residue, each of Y1, Y2 and Y3 is a divalent carbocyclic or heterocyclic residue, at least one of Z1 and Z2 is a residue having a reactive carbon-carbon double bond, and each of I, m, and n is an integer of 0 or larger.

  一种可固化组合物，包括(a)可溶于有机溶剂的可固化聚酰亚胺和(b)作为基本成分的聚合引发剂，所述聚酰亚胺由由式表示的递归单元组成 其中，X、X1、X2、X3 和 X4 中的每一个是四价碳环或杂环残基，Y1、Y2 和 Y3 中的每一个是二价碳环或杂环残基，Z1 和 Z2 中的至少一个是具有活性碳碳双键的残基，I、m 和 n 中的每一个是 0 或更大的整数。
• A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor
  申请人：Asahi Kasei Kogyo Kabushiki Kaisha

  公开号：EP0355927A2

  公开（公告）日：1990-02-28

  Disclosed is a polyimide precursor comprising a specific polyamic acid ester, polyamic amide or polyamic acid salt structure derived from a tetracarboxylic acid compound and a diamine compound, which can be converted by heating to a polyimide having low thermal stress. By blending a specific form of this novel polyimide precursor which has an ethylenic double bond, with a photopolymerization initiator, an excellent photopolymerizable composition can be obtained. Not only this precursor but also the crosslinked precursor obtained by the photopolymerization of the photopolymerizable composition can be converted by heating to a polyimide resin which has low thermal expansion coefficient, high heat resistance, excellent mechanical properties and satisfactory adhesion to a substrate. Hence, the precursor and the photopolymerizable composition can advantageously be utilized in the production of electrical and electronic components.

  本发明公开了一种聚酰亚胺前体，它由特定的聚酰胺酸酯、聚酰胺或聚酰胺酸盐结构组成，由四羧酸化合物和二胺化合物衍生而成，可通过加热转化为具有低热应力的聚酰亚胺。将这种具有乙烯双键的新型聚酰亚胺前体的特定形式与光聚合引发剂混合，可以得到一种极佳的光聚合组合物。不仅是这种前体，通过光聚合反应得到的交联前体也可以通过加热转化为聚酰亚胺树脂，这种树脂具有低热膨胀系数、高耐热性、优异的机械性能以及与基材的良好粘合性。因此，这种前体和可光聚合组合物可以很好地用于电气和电子元件的生产。
• Photosensitive resin composition and semiconductor apparatus using it
  申请人：SUMITOMO BAKELITE COMPANY LIMITED

  公开号：EP0430220A2

  公开（公告）日：1991-06-05

  The present invention provides a photosensitive resin composition which comprises as essential components: (A) a polyamic acid having a recurring unit represented by the following formula [I]: wherein 0.5-50 mol% of R₁ consists of a silicone diamine residue represented by the following formula [II]: wherein n represents an integer of 1-50, and the remainder of 50-99.5 mol% of R₁ consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, and a heterocyclic group, and R₂ consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, a heterocyclic group, and a silicone group, and m represents 1 or 2, (B) an amide compound having carbon-carbon double bond, and (C) a photosensitizer. The present invention further provides a semiconductor apparatus in which the above composition is used.

  本发明提供了一种光敏树脂组合物，其主要成分包括 (A) 具有下式[I]代表的递归单元的聚酰胺酸： 其中0.5-50 摩尔%的R₁由下式[II]代表的有机硅二胺残基组成： 其中n代表1-50的整数，其余50-99.5 mol％的R₁由选自芳香族基团、脂肪族基团、脂环族基团和杂环族基团的有机基团组成，R₂由选自芳香族基团、脂肪族基团、脂环族基团、杂环族基团和硅酮基团的有机基团组成，m代表1或2、 (B) 具有碳碳双键的酰胺化合物，和 (C) 一种光敏剂。 本发明进一步提供了一种使用上述组合物的半导体装置。
• Photosensitive polymer composition
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：EP0505161A1

  公开（公告）日：1992-09-23

  A photosensitive polymer composition comprising, in admixture, a polymer predominantly comprising a recurring unit of the formula ( I ): wherein X is a tri- or tetravalent organic group, Y is a divalent organic group, and n is equal to 1 or 2 and a compound having a urea bond of the formula ( II ): wherein R¹ is a group having a functional group capable of forming a dimer or polymer upon exposure to radiation, R² and R³ are independently a hydrogen atom or a monovalent organic group is shelf stable and applicable as relatively thick coatings having sufficient photosensitivity to form semiconductor element surface protective films.

  一种光敏聚合物组合物，包括主要由式 ( I ) 循环单元组成的聚合物： 其中 X 是三价或四价有机基团，Y 是二价有机基团，n 等于 1 或 2，以及具有式 ( II ) 脲键的化合物： 其中 R¹ 是具有官能团的基团，该官能团在暴露于辐射时能够形成二聚体或聚合物，R² 和 R³ 独立地为氢原子或一价有机基团。
• Polyamic acid and polyimide from fluorinated reactant
  申请人：International Business Machines Corporation

  公开号：EP0538683A1

  公开（公告）日：1993-04-28

  Copolyamic acid is obtained from tetracarboxylic acid dianhydride, diamine and a fluorinated diamine and/or fluorinated tetracarboxylic acid dianhydride; and optionally ester or amine salt derivative thereof to obtain radiation sensitive polymer; and low optical high thermally stable polyimide from curing the above polyamic acid and/or derivative thereof.

  由四羧酸二酐、二胺、氟化二胺和/或氟化四羧酸二酐及其酯或胺盐衍生物制得共聚酰胺酸，从而获得辐射敏感聚合物；由上述聚酰胺酸和/或其衍生物固化得到低光学高热稳定性聚酰亚胺。