申请人:Daicel Chemical Industries, Ltd.
公开号:US20030180662A1
公开(公告)日:2003-09-25
The photoresist resin composition comprises a polymer containing an acid-responsive compound unit of the following formula (e.g. an adamantane skeleton) and a photoactive acid precursor. R
1
may be an alkyl group having a tertiary carbon atom in the 1-position and the Z ring is a bridged-ring hydrocarbon ring comprising 2 to 4 rings.
1
wherein R
1
and R
2
are the same or different from each other and each represents a hydrogen atom, an alkyl group or a cycloalkyl group; R
3
represents a hydrogen atom or a methyl group; R
4
represents a hydrogen atom, a halogen atom, an alkyl group, an oxygen-containing group, an amino group or an N-substituted amino group; the Z ring represents a monocyclic or polycyclic alicyclic hydrocarbon ring; n represents an integer of not less than 1; with proviso that R
4
does not concurrently represent a hydrogen atom, and may be different over n occurrences; in formula (1), R
1
and R
2
may, jointly and together with the adjacent carbon atom, form an alicyclic hydrocarbon ring. The above photoresist resin composition is high in etching resistance, can be solubilized by irradiation, and is capable of providing a finer line pattern.
照片阻聚合物组成包括聚合物和光活性酸前体,其中聚合物含有以下式子的酸响应化合物单元(例如,金刚烷骨架):R1可以是1-位具有三级碳原子的烷基基团,Z环是由2至4个环组成的桥环烃环。其中,R1和R2相同或不同,每个表示氢原子、烷基或环烷基;R3表示氢原子或甲基基团;R4表示氢原子、卤素原子、烷基、含氧基团、氨基或N-取代氨基;Z环表示单环或多环脂环烃环;n表示不小于1的整数;但是R4不能同时表示氢原子,在n次出现时可以不同;在式(1)中,R1和R2可以与相邻碳原子共同形成脂环烃环。上述照片阻聚合物组成具有高蚀刻抗性,可以通过辐射溶解,并能够提供更细的线型图案。