壬基环己烷甲酸酯 | 70289-37-1

• 物质功能分类: 有机原料 - 杂环化合物
• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 脂肪酰基
• 中文名称: 壬基环己烷甲酸酯
• 英文名称: Nonyl cyclohexanecarboxylate
• CAS: 70289-37-1
• 化学式: C₁₆H₃₀O₂
• 分子量: 254.41
• InChiKey: VRJLOADUMBZEBS-UHFFFAOYSA-N

物化性质

• 保留指数：
  1806.51

计算性质

• 辛醇/水分配系数(LogP)：
  6.2
• 重原子数：
  18
• 可旋转键数：
  10
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.94
• 拓扑面积：
  26.3
• 氢给体数：
  0
• 氢受体数：
  2

文献信息

• COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTOR DEVICE
  申请人：Hitachi Chemical Company, Ltd.

  公开号：EP3569329A1

  公开（公告）日：2019-11-20

  A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 µm and less than or equal to 0.8 µm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 µm and less than or equal to 50 µm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300°C, and a content of the solvent having a boiling point of higher than or equal to 300°C is greater than or equal to 2 mass% on the basis of a total mass of the copper paste for pressureless bonding.

  一种用于无压粘接的铜浆料是一种用于无压粘接的铜浆料，包含：金属颗粒；以及一种分散介质，其中金属颗粒包括体积平均颗粒直径大于或等于0.01微米且小于或等于0.8微米的亚微型铜颗粒，以及体积平均颗粒直径大于或等于2.0 µm且小于或等于50 µm，分散介质中含有沸点高于或等于300°C的溶剂，且沸点高于或等于300°C的溶剂的含量大于或等于无压键合用铜浆总质量的2%。
• Copper paste for pressureless bonding, bonded body and semiconductor device
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US10930612B2

  公开（公告）日：2021-02-23

  A copper paste for pressureless bonding is a copper paste for pressureless bonding, containing: metal particles; and a dispersion medium, in which the metal particles include sub-micro copper particles having a volume average particle diameter of greater than or equal to 0.01 μm and less than or equal to 0.8 μm, and micro copper particles having a volume average particle diameter of greater than or equal to 2.0 μm and less than or equal to 50 μm, and the dispersion medium contains a solvent having a boiling point of higher than or equal to 300° C., and a content of the solvent having a boiling point of higher than or equal to 300° C. is greater than or equal to 2 mass % on the basis of a total mass of the copper paste for pressureless bonding.

  一种用于无压粘接的铜膏是一种用于无压粘接的铜膏，包含：金属颗粒；和分散介质，其中金属颗粒包括体积平均颗粒直径大于或等于 0.01 μm 且小于或等于 0.8 μm 的亚微型铜颗粒，以及体积平均颗粒直径大于或等于 2.0 μm 且小于或等于 50 μm 的微型铜颗粒，分散介质包含沸点高于或等于 300°C 的溶剂、沸点高于或等于 300 摄氏度的溶剂的含量大于或等于无压接合铜浆总质量的 2%。
• Metal paste for joints, assembly, production method for assembly, semiconductor device, and production method for semiconductor device
  申请人：HITACHI CHEMICAL COMPANY, LTD.

  公开号：US11370066B2

  公开（公告）日：2022-06-28

  Provided is A metal paste for joints, containing: metal particles; and monovalent carboxylic acid having 1 to 9 carbon atoms, in which the metal particles include sub-micro copper particles having a volume average particle diameter of 0.12 μm to 0.8 ηm, and a content of the monovalent carboxylic acid having 1 to 9 carbon atoms is 0.015 part by mass to 0.2 part by mass with respect to 100 parts by mass of the metal particles.

  提供了一种用于接缝的金属浆料，其中包含：金属颗粒；以及具有 1 至 9 个碳原子的一价羧酸，其中金属颗粒包括体积平均颗粒直径为 0.12 μm 至 0.8 ηm 的亚微型铜颗粒，并且具有 1 至 9 个碳原子的一价羧酸的含量相对于 100 重量份的金属颗粒为 0.015 重量份至 0.2 重量份。

表征谱图