环氧乙烷,2,2-[[2-(环氧乙烷YL甲氧基)-1,3-苯基ENE]双(亚甲基)]双- | 13561-08-5

• 物质功能分类: 有机原料 - 醚类化合物及其衍生物
• 分子结构分类: 有机化合物 - 苯类化合物 - 苯酚醚
• 中文名称: 环氧乙烷,2,2-[[2-(环氧乙烷YL甲氧基)-1,3-苯基ENE]双(亚甲基)]双-
• 中文别名: 2,2'-[[2-(环氧乙烷基甲氧基)-1,3-亚苯基]二(亚甲基)]二环氧乙烷
• 英文名称: 2,6-Diglycidylphenyl glycidyl ether
• 英文别名: 2-[[2,6-bis(oxiran-2-ylmethyl)phenoxy]methyl]oxirane
• CAS: 13561-08-5
• 化学式: C₁₅H₁₈O₄
• 分子量: 262.3
• InChiKey: PPEASEWKOGNDKZ-UHFFFAOYSA-N

物化性质

• 沸点：
  365.55°C (rough estimate)
• 密度：
  1.1584 (rough estimate)

计算性质

• 辛醇/水分配系数(LogP)：
  1.5
• 重原子数：
  19
• 可旋转键数：
  7
• 环数：
  4.0
• sp3杂化的碳原子比例：
  0.6
• 拓扑面积：
  46.8
• 氢给体数：
  0
• 氢受体数：
  4

ADMET

毒理性

• 副作用

皮肤致敏剂 - 一种可以诱导皮肤产生过敏反应的制剂。

Skin Sensitizer - An agent that can induce an allergic reaction in the skin.

来源:Haz-Map, Information on Hazardous Chemicals and Occupational Diseases

制备方法与用途

类别：有毒物品

• 毒性分级：中毒
• 急性毒性：
  • 口服（大鼠）：1620毫克/公斤
  • 皮肤（兔子）：2520毫克/公斤
• 刺激数据：
  • 皮肤（兔子）：500毫克，中度
• 爆炸物危险特性：
  • 温度高于140℃时分解
  • 冲击敏感，易爆炸
• 可燃性危险特性：
  • 可燃
  • 受热分解产生有毒氮氧化物和含汞烟雾
• 储运特性：
  • 库房需通风、低温干燥
  • 装卸时轻拿轻放
• 灭火剂：
  • 泡沫、二氧化碳、雾状水
• 职业标准：时间加权平均浓度（TWA）0.1毫克/立方米（汞），每立方米空气中含汞量不超过0.1毫克

文献信息

• RADIATION- OR THERMALLY-CURABLE BARRIER SEALANTS
  申请人：Kong Shengqian

  公开号：US20100164368A1

  公开（公告）日：2010-07-01

  This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.

  本发明涉及可固化密封剂，其在固化后提供低水分透过率和良好的粘接强度。该组分包括具有间位取代反应基团的芳香化合物和阳离子或自由基引发剂。
• TRIAZINE RING-CONTAINING POLYMER AND COMPOSITION FOR FILM FORMATION COMPRISING SAME
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US20140371367A1

  公开（公告）日：2014-12-18

  Provided is a triazine ring-containing hyperbranched polymer comprising the repeating unit structure represented by formula (1) and having one or more triazine ring terminals, said one or more triazine ring terminals being capped with a compound that differs from the diamine compound serving as the starting material for the polymer and has at least two active hydrogen groups. In addition to the polymer itself exhibiting high heat resistance, high transparency, a high refractive index, high light resistance, high solubility, and low volume shrinkage, it is also possible to use the polymer to provide a composition for film formation capable of yielding a thick film having high hardness. (In formula (1), R and R′ each independently represent a hydrogen atom, an alkyl group, an alkoxy group, an aryl group, or an aralkyl group, and Ar represents a divalent organic group containing an aromatic ring and/or a heterocyclic ring.)

  提供的是一种含有三嗪环的超支化聚合物，其重复单元结构由式（1）表示，并具有一个或多个三嗪环端基，其中，所述一个或多个三嗪环端基被与作为聚合物起始材料的二胺化合物不同的化合物封顶，该化合物具有至少两个活性氢基团。除了聚合物本身具有高耐热性、高透明度、高折射率、高耐光性、高溶解性和低体积收缩率之外，还可以使用该聚合物提供用于制备薄膜的组合物，该组合物能够产生具有高硬度的厚膜。（在式（1）中，R和R'各自独立地表示氢原子、烷基、烷氧基、芳基或芳烷基，Ar表示一个含有芳香环和/或杂环的二价有机基团。）
• AROMATIC POLYAMIDE AND FILM-FORMING COMPOSITION CONTAINING SAME
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US20150252147A1

  公开（公告）日：2015-09-10

  An aromatic polyamide, which is obtained by reacting a benzene tricarboxylic acid or a derivative thereof with a diamine compound in the presence of a terminally blocked compound having a crosslinkable group and a functional group that is reactive with a benzene tricarboxylic acid such as 1-amino-2-propanol or a derivative thereof as expressed by scheme (1), and which has a weight average molecular weight of 1,000-100,000 in terms of polystyrene as determined by gel permeation chromatography, has good solubility in organic solvents, while maintaining heat resistance and transparency. A thick film can be formed using a film-forming composition that contains this aromatic polyamide.

  一种芳香族聚酰胺，通过在末端阻断化合物的存在下，将苯三羧酸或其衍生物与一种含有可交联基团和与苯三羧酸反应的官能团的二胺化合物反应而获得，例如1-氨基-2-丙醇或其衍生物，如图1所示。其相对于聚苯乙烯的重均分子量在1000-100000之间，通过凝胶渗透色谱法测定。该聚酰胺在有机溶剂中具有良好的溶解性，同时保持耐热性和透明度。使用含有该芳香族聚酰胺的成膜组合物可以形成厚膜。
• DIENE/DIENOPHILE COUPLES AND THERMOSETTING RESIN COMPOSITIONS HAVING REWORKABILITY
  申请人：Henkel IP & Holding GmbH

  公开号：US20160002510A1

  公开（公告）日：2016-01-07

  Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

  提供了热固性树脂组合物，可用于安装在电路板上的半导体器件，例如芯片尺寸或芯片规模封装（“CSP”），球栅阵列（“BGA”），陆地栅格阵列（“LGA”）等（统称为“子组件”），或半导体芯片。当受到适当条件的影响时，该组合物的反应产物可被可控地重做。
• FILM-FORMING COMPOSITION
  申请人：NISSAN CHEMICAL INDUSTRIES, LTD.

  公开号：US20160017145A1

  公开（公告）日：2016-01-21

  A film-forming composition that contains a tricarbonyl-benzene hyperbranched-polymer cross-linker and a triazine-containing hyperbranch, as shown for example in the formula, can form a thin film that excels in terms of hardness and heat tolerance and exhibits a reduced decrease in index of refraction despite the addition of the cross-linker.

  含有三羰基苯超支化聚合物交联剂和三嗪基超支化物的成膜组合物，例如公式所示，可以形成一种优异的硬度和耐热性的薄膜，并且尽管添加了交联剂，折射率的降低也相对减少。