申请人:National Starch and Chemical Investment Holding Corporation
公开号:EP1422279A1
公开(公告)日:2004-05-26
This invention relates to a semiconductor package in which a silicon die is adhered to a substrate with an adhesive comprising a resin having the structure:
or
in which Q is an oligomeric or polymeric group containing at least one carbon to carbon double bond, A is a hydrocarbyl group or an aromatic group, and L is a linking group resulting from the reaction of a functional group, excluding epoxy, on the precursor for the segment containing silane and a functional group, excluding epoxy, on the precursor for the segment containing the at least one carbon to carbon double bond
本发明涉及一种半导体封装,在这种封装中,硅芯片与基板之间用一种由具有以下结构的树脂组成的粘合剂粘合:
或
其中 Q 是含有至少一个碳碳双键的低聚或聚合基团,A 是烃基或芳香基,L 是连接基团,该连接基团是由含有硅烷的片段的前体上的官能团(环氧除外)和含有至少一个碳碳双键的片段的前体上的官能团(环氧除外)反应生成的。