The present invention relates to a copper electroplating composition comprising a copper alkanesulfonate salt, a free alkanesulfonic acid, and one or more organic compounds selected from the group consisting of suppressors, accelerators, levelers, and mixtures thereof, in which the concentration of free acid is from 0 M to about 0.25 M and the composition is free of halide ions. The present invention also relates to a process of metalizing micro-sized trenches or vias in a substrate using the composition.
本发明涉及一种
铜电镀组合物,包括
铜烷基
磺酸盐、自由烷基
磺酸和从
抑制剂、加速剂、平整剂和其混合物中选择的一种或多种有机化合物,其中自由酸的浓度从0 M到约0.25 M,且该组合物不含卤化物离子。本发明还涉及使用该组合物
金属化基板中微小沟槽或孔道的过程。