3-甲基-1-十三碳炔-3-醇 | 100912-15-0

• 分子结构分类: 有机化合物 - 有机氧化合物
• 中文名称: 3-甲基-1-十三碳炔-3-醇
• 英文名称: 3-methyltridec-1-yn-3-ol
• 英文别名: 3-Methyl-tridec-1-in-3-ol；1-Tridecyn-3-ol, 3-methyl-
• CAS: 100912-15-0
• 化学式: C₁₄H₂₆O
• 分子量: 210.36
• InChiKey: VRIOCRYNFBWGRF-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  4.9
• 重原子数：
  15
• 可旋转键数：
  10
• 环数：
  0.0
• sp3杂化的碳原子比例：
  0.86
• 拓扑面积：
  20.2
• 氢给体数：
  1
• 氢受体数：
  1

反应信息

• 作为反应物：
  描述：

  3-甲基-1-十三碳炔-3-醇 、 一氧化碳 在 双(乙腈)氯化钯(II) 、 2-(di-tert-butylphosphino)-1-(2,6-diisopropylphenyl)-1H-imidazole 作用下， 以 甲基叔丁基醚 为溶剂， 100.0 ℃ 、4.0 MPa 条件下， 反应 20.0h， 以90%的产率得到4-decyl-4-methyl-3-methyleneoxetan-2-one
  参考文献：
  名称：

  炔烃的配体控制的钯催化的羰基化：α-亚甲基-β-内酯的高度选择性合成。

  摘要：

  报道了第一个普通的和区域选择性的Pd催化的环羰基化反应，生成α-亚甲基-β-内酯。该工艺成功的关键是在Pd（MeCN）2 Cl 2作为预催化剂的情况下，使用基于N-芳基化咪唑（L11）的特定空间要求的膦配体。在无添加剂条件下，各种容易获得的炔醇以中等至良好的产率提供相应的α-亚甲基-β-内酯，具有出色的区域选择性和非对映选择性。这种新方法的适用性通过包括天然产物在内的生物活性分子的直接羰基化得以展示。

  DOI：

  10.1002/anie.202006550
• 作为产物：
  描述：

  2-十二烷酮 、 乙炔钠 在 乙醚 、 氨 作用下， 生成 3-甲基-1-十三碳炔-3-醇
  参考文献：
  名称：

  Weichet et al., Collection of Czechoslovak Chemical Communications, 1959, vol. 24, p. 2754,2758

  摘要：

  DOI：

文献信息

• Addition curing silicone composition for CIPG with very good compression set and method of reducing compression set
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP1788032A2

  公开（公告）日：2007-05-23

  Provided is an addition curing silicone composition for CIPG, including: (A) 100 parts by mass of an organopolysiloxane containing at least two alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane, in sufficient quantity to provide from 0.4 to 10.0 mols of hydrogen atoms bonded to silicon atoms within this component (B) for every 1 mol of alkenyl groups bonded to silicon atoms within the entire composition, (C) an effective quantity of a platinum group metal-based catalyst, (D) a curing retarder, and (E) an acid-receiving agent which is inorganic. The composition yields a cured product with particularly superior compression set, and exhibits excellent storage stability, curing stability (curability following storage), and adhesion. The compression set for a cured product of an addition curing silicone composition including the aforementioned components (A) through (D) can be reduced by preparing a composition including said components (A) through (E) and curing said composition including said components (A) through (E) at room temperature or under heating.

  提供了一种用于CIPG的加成固化有机硅组合物，包括：(A)100质量份的有机聚硅氧烷，其每个分子内至少含有两个与硅原子键合的烯基；(B)有机氢聚硅氧烷，其数量足以在该组分(B)内提供0.4至10.(C) 有效量的铂族金属基催化剂，(D) 固化延缓剂，和 (E) 无机受酸剂。这种组合物产生的固化产品具有特别优异的压缩永久变形，并表现出卓越的储存稳定性、固化稳定性（储存后的固化性）和粘附性。通过制备包含上述成分（A）至（E）的组合物，并在室温或加热条件下固化包含上述成分（A）至（E）的组合物，可以降低包含上述成分（A）至（D）的添加固化硅氧烷组合物固化物的压缩永久变形。
• Thermosetting Resin Composition for Semiconductor Encapsulation and Encapsulated Semiconductor Device
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP2615141A2

  公开（公告）日：2013-07-17

  A thermosetting resin composition for semiconductor encapsulation contains a both end allyl isocyanurate ring-terminated organopolysiloxane polymer as a sole base polymer and an isocyanurate ring-containing organohydrogenpolysiloxane polymer as a sole curing agent or crosslinker. When a semiconductor element array having semiconductor elements mounted on a substrate with an adhesive is encapsulated with the thermosetting resin composition, warp-free semiconductor devices having improved heat resistance and moisture resistance are obtainable.

  一种用于半导体封装的热固性树脂组合物含有作为唯一基础聚合物的两端烯丙基异氰脲酸酯环端有机聚硅氧烷聚合物和作为唯一固化剂或交联剂的含异氰脲酸酯环的有机氢聚硅氧烷聚合物。当用热固性树脂组合物封装用粘合剂将半导体元件安装在基板上的半导体元件阵列时，可获得耐热性和防潮性均得到改善的无翘曲半导体器件。
• GLYCOLURILS HAVING FUNCTIONAL GROUP AND USE THEREOF
  申请人：Shikoku Chemicals Corporation

  公开号：EP3075735A1

  公开（公告）日：2016-10-05

  The invention provides a glycoluril represented by the general formula (Z): wherein the group Z represents a carboxyalkyl, a glycidyl or an allyl group; R1 and R2 each independently represents a hydrogen atom, a lower alkyl or a phenyl group; R3, R4 and R5 each independently represents a hydrogen atom or the group identical with the group Z; however, when the group Z is a carboxyalkyl group, R3, R4 and R5 are the same carboxyalkyl groups as the group Z; and when the group Z is an allyl group, R5 represents a hydrogen atom. The invention further provides various resin compositions, for example, polyester resin compositions, epoxy resin compositions, and silicone resin compositions each comprising the glycoluril.

  本发明提供了一种由通式 (Z) 代表的羟基苯磺酸： 其中基团 Z 代表羧烷基、缩水甘油基或烯丙基；R1 和 R2 各自独立地代表氢原子、低级烷基或苯基；R3、R4 和 R5 各自独立地代表氢原子或与基团 Z 相同的基团；但是，当基团 Z 是羧烷基时，R3、R4 和 R5 是与基团 Z 相同的羧烷基；当基团 Z 是烯丙基时，R5 代表氢原子。本发明进一步提供了各种树脂组合物，例如，聚酯树脂组合物、环氧树脂组合物和硅树脂组合物，每种组合物都包含羟基乙酸乙酯。
• INSULATING HEAT DISSIPATION SHEET
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3156457A1

  公开（公告）日：2017-04-19

  Provided is an insulating heat dissipation sheet hardly producing cracks, and exhibiting a favorable insulation property. The insulating heat dissipation sheet consists of a cured product of an organopolysiloxane composition comprising: (a) 100 parts by mass of an organopolysiloxane exhibiting an average degree of polymerization of 3,000 to 10,000; (b) 10 to 100 parts by mass of an organopolysiloxane exhibiting an average degree of polymerization of 2 to 2,000, and having alkenyl groups only at both ends of a molecular chain thereof, but at no other position on the molecular chain; (c) 2 to 20 parts by mass of an organohydrogenpolysiloxane having hydrogen atoms directly bonded to silicon atoms (Si-H groups); (d) 100 to 300 parts by mass of a boron nitride aggregate; (e) 0.1 to 10 parts by mass of a peroxide cross-linking agent; and (f) 0.1 to 10 parts by mass of a platinum group curing catalyst.

  本发明提供了一种不易产生裂缝并具有良好隔热性能的隔热散热片。这种隔热散热片由有机聚硅氧烷组合物的固化产物组成，该组合物包括 (a) 100 重量份的有机聚硅氧烷，其平均聚合度为 3,000 至 10,000； (b) 10 至 100 质量份的有机聚硅氧烷，其平均聚合度为 2 至 2,000，且仅在其分子链的两端有烯基，而在分子链的其他位置没有烯基； (c) 2 至 20 质量份的有机氢聚硅氧烷，其氢原子直接与硅原子结合（Si-H 基团）； (d) 100 至 300 质量份的氮化硼聚合体； (e) 0.1 至 10 质量份的过氧化物交联剂；以及 (f) 0.1 至 10 重量份的铂族固化催化剂。
• SILICONE RESIN TRANSPARENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
  申请人：Shin-Etsu Chemical Co., Ltd.

  公开号：EP3287275A1

  公开（公告）日：2018-02-28

  The present invention provides a silicone resin transparent substrate, including one or more than one prepreg containing a silicone resin composition and a fibrous base, wherein the silicone resin transparent substrate has: an attached amount of the silicone resin composition to the fibrous base of 60% by mass or more and 99% by mass or less; a total light transmittance of 80% or more at 450 nm, as measured by a method disclosed in JIS K 7375:2008 in a thickness of 0.1 mm to 0.4 mm; and a water vapor permeability of 65 g/m2•day or less, as measured by Lyssy method in conformity with JIS K 7129:2008 in a thickness of 0.1 mm to 0.4 mm; together with a method for manufacturing the same. The silicone resin transparent substrate has excellent heat resistance and weatherability, together with flexibility, high transparency, and lower moisture permeability.

  本发明提供了一种硅树脂透明基材，包括一种或一种以上含有硅树脂组合物和纤维基的预浸料，其中硅树脂透明基材具有：硅树脂组合物与纤维基的附着量为60%(质量)或以上且99%(质量)或以下；根据JIS K 7375:2008中公开的方法测量，在450纳米处的总透光率为80%或以上，厚度为0.根据 JIS K 7129:2008 中公开的方法测量，厚度为 0.1 毫米至 0.4 毫米的硅树脂透明基材在 450 纳米波长下的总透光率为 80% 或以上；以及根据 JIS K 7129:2008 中公开的方法测量，厚度为 0.1 毫米至 0.4 毫米的硅树脂透明基材在 0.1 毫米至 0.4 毫米波长下的水蒸气透过率为 65 克/平方米-天或以下；以及制造方法。硅树脂透明基材具有优异的耐热性和耐候性，同时还具有柔韧性、高透明度和较低的透湿性。