申请人:Fujifilm Corporation
公开号:EP2202220A1
公开(公告)日:2010-06-30
[Problem to be Solved]
To provide an acetylene compound having a structure in which a unit having an amino group and a unit having an ethynyl group are bonded via a linking group, the acetylene compound being introducable to a polymer having thermal resistance.
[Means for Solving the Problem] An acetylene compound represented by the following Formula (1) and a salt thereof:
wherein in Formula (1), X represents a single bond or a divalent linking group; A represents a hydrocarbon group, a heteroaromatic ring or a heteroalicyclic compound; B represents a hydrocarbon group, a heteroaromatic ring, a heteroalicyclic compound or a single bond; R1 represents a hydrogen atom, a hydrocarbon group, a heteroaromatic ring, a heteroalicyclic compound or a silyl group; R4 represents a hydrogen atom or a group that can be a substituent of an amino group; and m, n and a each independently represent an integer of 1 or greater.
解决的问题是提供一种乙炔化合物,其结构中含有通过连接基团连接的具有氨基团和乙炔基团的单元,该乙炔化合物可引入到具有热阻抗的聚合物中。解决问题的方法是通过以下式(1)表示的乙炔化合物及其盐:其中在式(1)中,X代表单键或二价连接基团;A代表烃基团、杂环芳香环或杂环脂环化合物;B代表烃基团、杂环芳香环、杂环脂环化合物或单键;R1代表氢原子、烃基团、杂环芳香环、杂环脂环化合物或硅基团;R4代表氢原子或可作为氨基团的取代基团;m、n和a分别独立表示大于或等于1的整数。