Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board
申请人:DIC Corporation
公开号:US10011676B2
公开(公告)日:2018-07-03
There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I):
wherein X is a structural site represented by the following Structural Formula (x1) or (x2);
in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other;
wherein p is 1 or 2.
本发明提供了一种含有酚羟基的化合物(其固化物具有优异的耐热性和优异的阻燃性)、包括该化合物的酚醛树脂、固化组合物及其固化物、半导体密封材料和印刷电路板。含有酚羟基的化合物具有如下通式 (I) 所表示的分子结构:
其中 X 是由下式(x1)或(x2)表示的结构位点;
在式 (x1) 或 (x2) 中,k 是 1 至 3 的整数,m 是 1 或 2,Ar 是由以下结构式 (Ar1) 表示的结构位点,当 k 或 m 为 2 或更大时,多个 Ar 可以彼此相同或不同;
其中 p 为 1 或 2。