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3-oxa-bicyclo[3.3.1]nonan-2-one | 88314-71-0

中文名称
——
中文别名
——
英文名称
3-oxa-bicyclo[3.3.1]nonan-2-one
英文别名
3-Oxa-bicyclo[3.3.1]nonan-2-on;Oxabicyclo[3.3.1]nonanone;3-oxabicyclo[3.3.1]nonan-2-one
3-oxa-bicyclo[3.3.1]nonan-2-one化学式
CAS
88314-71-0
化学式
C8H12O2
mdl
——
分子量
140.182
InChiKey
CLICQHLXHWRQDC-UHFFFAOYSA-N
BEILSTEIN
——
EINECS
——
  • 物化性质
  • 计算性质
  • ADMET
  • 安全信息
  • SDS
  • 制备方法与用途
  • 上下游信息
  • 反应信息
  • 文献信息
  • 表征谱图
  • 同类化合物
  • 相关功能分类
  • 相关结构分类

计算性质

  • 辛醇/水分配系数(LogP):
    1.5
  • 重原子数:
    10
  • 可旋转键数:
    0
  • 环数:
    2.0
  • sp3杂化的碳原子比例:
    0.88
  • 拓扑面积:
    26.3
  • 氢给体数:
    0
  • 氢受体数:
    2

反应信息

  • 作为反应物:
    描述:
    3-oxa-bicyclo[3.3.1]nonan-2-one三甲基氯硅烷lithium chloridelithium diisopropyl amide 作用下, 以 四氢呋喃 为溶剂, 反应 3.0h, 以61%的产率得到1-Trimethylsilanyl-3-oxa-bicyclo[3.3.1]nonan-2-one
    参考文献:
    名称:
    桥头烯烯酸酯:氨基酰胺锂取代和取代桥联的小羰基化合物。
    摘要:
    [反应:见正文]与预期相反,许多桥接的羰基化合物与酰胺基锂进行了容易的桥头金属化。已证明二酮,内酯,内酰胺和酰亚胺官能团都参与了这种类型的“桥头烯醇盐”化学反应,从而产生了一系列取代产物。还可以通过不对称桥头金属化在非常高的ee中对内消旋化合物进行对称化。
    DOI:
    10.1021/ol034348l
  • 作为产物:
    描述:
    alkaline earth salt of/the/ methylsulfuric acid 在 作用下, 生成 3-oxa-bicyclo[3.3.1]nonan-2-one
    参考文献:
    名称:
    Komppa et al., Justus Liebigs Annalen der Chemie, 1936, vol. 521, p. 242,260
    摘要:
    DOI:
点击查看最新优质反应信息

文献信息

  • PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE AND COMPOUND
    申请人:FUJIFILM CORPORATION
    公开号:US20160070167A1
    公开(公告)日:2016-03-10
    There is provided a pattern forming method comprising (i) a step of forming a film containing an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a compound represented by the specific formula, (B) a compound different from the compound (A) and capable of generating an acid upon irradiation with an actinic ray or radiation, and (P) a resin that does not react with the acid generated from the compound (A) and is capable of decreasing the solubility for an organic solvent-containing developer by the action of the acid generated from the compound (B), (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern; the actinic ray-sensitive or radiation-sensitive resin composition above; a resist film using the composition.
    提供了一种图案形成方法,包括(i)形成一种薄膜,其中包含一种感光树脂组成物,该组成物包含(A)一种特定化学式代表的化合物,(B)一种不同于化合物(A)的化合物,在接受光辐射后能够产生酸,并且(P)一种树脂,该树脂不会与从化合物(A)产生的酸发生反应,并且能够通过来自化合物(B)产生的酸的作用降低有机溶剂含有的显影剂的溶解度,(ii)曝光薄膜,(iii)使用有机溶剂含有的显影剂对曝光后的薄膜进行显影,形成负图案;上述感光树脂组成物;使用该组成物的抗蚀膜。
  • ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
    申请人:FUJIFILM Corporation
    公开号:US20210356862A1
    公开(公告)日:2021-11-18
    An actinic ray-sensitive or radiation-sensitive resin composition includes a compound represented by General Formula (I) and an acid-decomposable resin. M 1 + A − -L-B − M 2 + (I)
    一种感光射线或辐射敏感的树脂组合物,包括通式(I)所表示的化合物和可酸分解树脂。M1+A−-L-B−M2+(I)
  • Pattern forming method, method for manufacturing electronic device, monomer for producing resin for semiconductor device manufacturing process, resin, method for producing resin, actinic ray-sensitive or radiation-sensitive resin composition, and actinic ray-sensitive or radiation-sensitive film
    申请人:FUJIFILM Corporation
    公开号:US11150557B2
    公开(公告)日:2021-10-19
    Provided are a pattern forming method including a film forming step of forming a film using a resin composition containing a resin (A) obtained from a monomer having a silicon atom, the monomer having a turbidity of 1 ppm or less based on JIS K0101:1998 using formazin as a reference material and an integrating sphere measurement system as a measurement system, in which the pattern forming method is capable of remarkably improving scum defect performance, particularly in formation of an ultrafine pattern (for example, a line-and-space pattern having a line width of 50 nm or less, or a hole pattern having a hole diameter of 50 nm or less); and a method for manufacturing an electronic device, using the pattern forming method.
    本发明提供了一种图案形成方法,包括使用树脂组合物形成薄膜的成膜步骤,该树脂组合物含有从具有原子的单体中获得的树脂 (A),根据 JIS K0101:1998,使用甲臢作为参考材料和积分球测量系统作为测量系统,其中图案形成方法能够显著改善浮渣缺陷性能,尤其是在形成超细图案(例如,线宽为 50 nm 或以下的线-空图案,或孔径为 50 nm 或以下的孔图案)时);以及使用该图案形成方法制造电子设备的方法。
  • EPOXY RESINS AND PROCESSES FOR PREPARING THE SAME
    申请人:Hefner, JR. Robert E.
    公开号:US20110039982A1
    公开(公告)日:2011-02-17
    Epoxy resins comprising a cis, trans-1,3- and -1,4-cyclohexanedimethylether moiety and processes for preparing the epoxy resins. The process of preparation of the epoxy resins comprises reacting (a) a mixture of a cis-1,3-cyclohexanedimethanol, a trans-1,3-cyclohexanedimethanol, a cis-1,4-cyclohexanedimethanol, and a trans-1,4-cyclohexanedimethanol, (b) an epihalohydrin, (c) a basic acting substance, (d) optionally, a solvent, (e) optionally, a catalyst, and/or (f) optionally, a dehydrating agent. The process may be a slurry epoxidation process, an anhydrous epoxidation process, or a Lewis acid catalyzed coupling and epoxidation process.
  • PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE
    申请人:FUJIFILM Corporation
    公开号:US20150111154A1
    公开(公告)日:2015-04-23
    There is provided a pattern forming method including: (a) a process of forming a film by resin (P) having a repeating unit (a) having a cyclic structure and a partial structure represented by the following Formula (I), (II-1) or (II-2), and a repeating unit (b) having a group which decomposes by the action of an acid to generates a polar group, and an actinic ray-sensitive or radiation-sensitive resin composition containing compound (B) which generates acid upon irradiation with an actinic ray or radiation; (b) a process of exposing the film; and (c) a process of forming a negative-type pattern by performing development using a developer including an organic solvent, an actinic ray-sensitive or radiation-sensitive resin composition used therefor, a resist film, a method of manufacturing an electronic device, and an electronic device.
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