dicyclopentenyloxyethyl methacrylate | 66008-64-8

• 分子结构分类: 有机化合物 - 脂质和类脂质分子 - 异戊烯醇脂质
• 英文名称: dicyclopentenyloxyethyl methacrylate
• 英文别名: DCPMA；DCPOMA；2-Propenoic acid, 2-methyl-, 2-[(3A,4,5,6,7,7A-hexahydro-4,7-methano-1H-inden-6-YL)oxy]ethyl ester；2-(8-tricyclo[5.2.1.02,6]dec-3-enyloxy)ethyl 2-methylprop-2-enoate
• CAS: 66008-64-8
• 化学式: C₁₆H₂₂O₃
• 分子量: 262.349
• InChiKey: HZCOEAIFIFURAN-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  3
• 重原子数：
  19
• 可旋转键数：
  6
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.69
• 拓扑面积：
  35.5
• 氢给体数：
  0
• 氢受体数：
  3

反应信息

• 作为产物：
  描述：

  甲基丙烯酸羟乙酯 、 二聚环戊二烯 在 copper(II) bis(trifluoromethanesulfonate) 作用下， 以 1,4-二氧六环 为溶剂， 反应 4.5h， 以85%的产率得到dicyclopentenyloxyethyl methacrylate
  参考文献：
  名称：

  三氟甲磺酸铜（II）作为三氟甲磺酸的来源：加氢烷氧基化反应的有效，绿色催化

  摘要：

  用各种金属基路易斯酸和强布朗斯台德酸研究了二环戊二烯（DCPD）和降冰片烯（NB）与甲基丙烯酸2-羟乙酯（HEMA）的加氢烷氧基化反应，以合成工业上相关的单体。在没有其他添加剂的情况下，三氟甲磺酸铜（II）是最有效的催化剂体系。动力学，电子自旋共振（ESR），催化剂中毒和交叉实验表明，三氟甲磺酸（TfOH）是这些反应中真正的活性催化剂。TfOH的这种原位生成是通过还原Cu（OTf）2来实现的由烯烃试剂（DCPD，NB）制成。反应混合物中存在的铜离子起自由基聚合抑制剂的作用，阻止了HEMA的聚合（这在大多数其他金属盐和强布朗斯台德酸中均可观察到），从而提高了所需产物的选择性和收率（最高95％） 。这些观察结果导致开发了一种高效的绿色工艺，该工艺使用了基于TfOH和酚类自由基抑制剂（2,5-二叔丁基羟基甲苯， BHT）。

  DOI：

  10.1002/adsc.200800750

文献信息

• Photocurable coating composition, and overprint and process for producing same
  申请人：FUJIFILM Corporation

  公开号：EP2042564A1

  公开（公告）日：2009-04-01

  A photocurable coating composition is provided that includes an ethylenically unsaturated compound having an alicyclic hydrocarbon group and a photopolymerization initiator. There are also provided a process for producing an overprint, the process including a step of obtaining a printed material by printing on a printing substrate, a step of coating the printed material with the photocurable coating composition, and a step of photocuring the photocurable coating composition, an overprint produced by the process, use of the photocurable coating composition for producing an overprint, and use of the photocurable coating composition for producing an overprint for an electrophotographically printed material.

  提供了一种光固化涂层组合物，它包括具有脂环烃基团的乙烯基不饱和化合物和光聚合引发剂。还提供了一种用于生产叠印的工艺，该工艺包括通过在印刷基材上印刷获得印刷材料的步骤、用可光化的涂层组合物涂覆印刷材料的步骤、对可光化的涂层组合物进行光固化的步骤、由该工艺生产的叠印、使用可光化的涂层组合物生产叠印，以及使用可光化的涂层组合物生产电致发光印刷材料的叠印。
• EMMONS, W. D.;NYI, K.
  作者：EMMONS, W. D.、NYI, K.

  DOI：——

  日期：——
• PATTERN TREATMENT METHODS
  申请人：Rohm and Haas Electronic Materials LLC

  公开号：US20180031975A1

  公开（公告）日：2018-02-01

  A pattern treatment method, comprising: (a) providing a semiconductor substrate comprising a patterned feature on a surface thereof; (b) applying a pattern treatment composition to the patterned feature, wherein the pattern treatment composition comprises: a block copolymer and an organic solvent, wherein the block copolymer comprises: (i) a first block comprising a first unit formed from 4-vinyl-pyridine, and (ii) a second block comprising a first unit formed from a vinyl aromatic monomer; and (c) removing residual pattern shrink composition from the substrate, leaving a coating of the block copolymer over the surface of the patterned feature, thereby providing a reduced pattern spacing as compared with a pattern spacing of the patterned feature prior to coating the pattern treatment composition. The methods find particular applicability in the manufacture of semiconductor devices for providing high resolution patterns.
• GAS SENSOR AND METHOD OF MANUFACTURE THEREOF
  申请人：Rohm and Haas Electronic Materials LLC

  公开号：US20180088073A1

  公开（公告）日：2018-03-29

  Disclosed herein is a gas sensor comprising a substrate; a first polymeric layer having a first surface and a second surface disposed on the substrate; where the first surface contacts the substrate and where the second surface is opposed to the first surface and has a higher surface area than the first surface; where the first polymeric layer comprises repeat units that have a deprotected hydrogen donor; and a second polymeric layer disposed on the first polymeric layer; where the second polymeric layer is derived from a repeat unit that comprises a hydrogen acceptor.
• US9665005B2
  申请人：——

  公开号：US9665005B2

  公开（公告）日：2017-05-30