申请人:NITTO DENKO CORPORATION
公开号:EP0160558A2
公开(公告)日:1985-11-06
A fixing composition comprises a polyimide precursor, and organic solvent, optionally an epoxy resin, e.g. a bisphenol A type, optionally with a heat-activated hardener, and possibly other additives. The precursor is preferably a polyamic acid synthesized from an aliphatic tetracarboxylic dianhydride or lower alkyl ester or halide thereof and an organic diamine optionally with a triamine or tetramine.
A sheet 0.5 to 5 mm thick of a powdered metal alloy, e.g. a multi-component eutectic alloy and a synthetic resin binder composition, e.g. an acrylic copolymer and an adhesive component, is placed on a metal substrate, e.g. of steel; a molded film or coated layer of 5-50 µm thickness of the fixing composition is placed therebetween. The assembly is heated and an adhesive force is exerted due to hardening of the precursor; heating is continued to sintering temperature, e.g. 1,000 to 1,150°C, at which the precursor is carbonised to a residual C content of 10 to 60 wt%, and the alloy sinters to the substrate.
The alloy sheet is adhered firmly to the substrate before and during sintering.
固定组合物包括聚酰亚胺前体、有机溶剂、环氧树脂(如双酚 A 型)、热激活固化剂以及其他可能的添加剂。前驱体最好是由脂肪族四羧酸二酐或其低级烷基酯或卤化物与有机二胺(可选三胺或四胺)合成的聚酰胺酸。
将 0.5 至 5 毫米厚的粉末状金属合金(如多组分共晶合金)和合成树脂粘合剂组合物(如丙烯酸共聚物和粘合剂组分)的薄片放在金属基板(如钢)上;在两者之间放置厚度为 5-50 微米的固定组合物模压薄膜或涂层。将组件加热,由于前驱体硬化而产生粘合力;继续加热至烧结温度,例如 1,000 至 1,150°C 时,前驱体碳化,残余 C 含量为 10 至 60 wt%,合金烧结到基底上。
在烧结前和烧结过程中,合金片都会牢固地粘附在基底上。