Positive chemically amplified resist composition and method for producing compounds used therein
申请人:FUJI PHOTO FILM CO., LTD.
公开号:EP0709736A1
公开(公告)日:1996-05-01
A positive chemically amplified resist composition is disclosed, comprising (a) a compound which generates an acid upon irradiation with active light or radiant ray; (b) a resin insoluble in water but soluble in an aqueous alkali solution; and (c) a low molecular acid-decomposable dissolution inhibitor having a molecular weight of 3,000 or less and containing an acid-decomposable alkyl ester group represented by formula (I), and which increases its solubility in an alkali developer by the action of an acid, and having a sodium content and a potassium content each of 30 ppb or less. Also disclosed is a positive chemically amplified resist composition comprising the foregoing compound (a) and (d) a resin having an acid-decomposable alkyl ester group represented by formula (I), and which increases its solubility in an alkali developer by the action of an acid, and having a sodium content and a potassium content each of 30 ppb or less. Still further disclosed are methods for producing the compounds (c) and (d).
本发明公开了一种正化学放大抗蚀剂组合物,其中包括:(a) 一种在活性光或辐射线照射下产生酸的化合物;(b) 一种不溶于水但可溶于碱水溶液的树脂;(c) 低分子可酸分解溶解抑制剂,其分子量在 3,000 或以下,并含有由式(I)代表的可酸分解烷基酯基团,在酸的作用下可增加其在碱显影剂中的溶解度,其钠含量和钾含量均在 30 ppb 或以下。还公开了一种正化学放大抗蚀剂组合物,该组合物包含前述化合物(a)和(d),该树脂具有由式(I)表示的可酸化分解的烷基酯基团,在酸的作用下可增加其在碱显影剂中的溶解度,且钠含量和钾含量均不超过 30 ppb。还进一步公开了生产化合物(c)和(d)的方法。