Negative-type photosensitive resin composition, pattern forming method, cured film, insulating film, color filter, and display device
申请人:Shiota Dai
公开号:US09244346B2
公开(公告)日:2016-01-26
A negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure; a pattern forming method using the resin composition; a cured film, an insulating film, a color filter formed using resin composition; and a display device provided with the cured film, insulating film, or color filter. The resin composition contains a compound represented by the following formula (1). In the formula, R1 and R2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 indicates a single bond or an organic group. R4 to R9 each independently indicate a hydrogen atom, an organic group, etc., but R6 and R7 are never hydroxyl groups. R10 indicates a hydrogen atom or an organic group.
一种负型光敏树脂组合物,能够在低光照下形成具有良好粘附性的图案;使用该树脂组合物的图案形成方法;使用该树脂组合物形成的固化膜、绝缘膜、彩色滤光片;以及具有固化膜、绝缘膜或彩色滤光片的显示装置。该树脂组合物包含以下式(1)所表示的化合物。在该式中,R1和R2各自独立表示氢原子或有机基团,但至少一个表示有机基团。R1和R2可以结合形成环状结构,并且可以含有杂原子键。R3表示单键或有机基团。R4到R9各自独立表示氢原子、有机基团等,但R6和R7永远不是羟基。R10表示氢原子或有机基团。