申请人:NITTO DENKO CORPORATION
公开号:EP2957610A1
公开(公告)日:2015-12-23
The present invention provides an approach for making adhesive compositions and in particular pressure sensitive adhesive compositions that possess adjustable adhesion level allowing debonding on-demand in an easy, rapid and cost-efficient manner, wherein said approach can be easily applied to a wide variety of different adhesive systems without need for complex adaptation of the adhesive systems. The adhesive compositions of the present invention are characterized by an adhesive system and a debonding component, wherein the debonding component is an organic compound having a molecular weight of from 200 g/mol to 10000 g/mol, which debonding component contains two or more photodimerizable groups.
本发明提供了一种制造粘合剂组合物,特别是压敏型粘合剂组合物的方法,这种组合物具有可调节的粘合力水平,能够以简单、快速和具有成本效益的方式按需剥离,其中所述方法可轻松应用于各种不同的粘合剂体系,而无需对粘合剂体系进行复杂的调整。本发明的粘合剂组合物的特征是由粘合剂体系和脱粘组分组成,其中脱粘组分是一种有机化合物,其分子量在 200 克/摩尔到 10000 克/摩尔之间,脱粘组分含有两个或两个以上可光二聚化的基团。