LATENT CURING AGENTS, EPOXY RESIN COMPOSITIONS CONTAINING THE SAME, SEALING MATERIALS, AND ORGANIC EL DISPLAYS
申请人:Tamatani Hiroaki
公开号:US20100253213A1
公开(公告)日:2010-10-07
The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.
US8466238B2
申请人:——
公开号:US8466238B2
公开(公告)日:2013-06-18
Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic EL displays
申请人:Tamatani Hiroaki
公开号:US08466238B2
公开(公告)日:2013-06-18
The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.