Novel sulfonyldiazomethanes, photoacid generators, resist compositions, and patterning process
申请人:——
公开号:US20040167322A1
公开(公告)日:2004-08-26
A chemical amplification type resist composition comprising a specific benzenesulfonyldiazomethane containing a long-chain alkoxyl group at the 2-position on benzene ring has many advantages including improved resolution, improved focus latitude, minimized line width variation or shape degradation even on long-term PED, minimized debris left after coating, development and peeling, and improved pattern profile after development and is thus suited for microfabrication.
Photoacid generators, chemically amplified resist compositions, and patterning process
申请人:Ohsawa Youichi
公开号:US20070292768A1
公开(公告)日:2007-12-20
A photoacid generator has formula (1). A chemically amplified resist composition comprising the photoacid generator has advantages including a high resolution, focus latitude, long-term PED dimensional stability, and a satisfactory pattern profile shape. When the photoacid generator is combined with a resin having acid labile groups other than those of the acetal type, resolution and top loss are improved. The composition is suited for deep UV lithography.
The present invention relates to: a resist composition such as a chemically amplified resist composition for providing an excellent pattern profile even at a substrate-side boundary face of resist, in addition to a higher resolution in photolithography for micro-fabrication, and particularly in photolithography adopting, as an exposure source, KrF laser, ArF laser, F
2
laser, ultra-short ultraviolet light, electron beam, X-rays, or the like; and a patterning process utilizing the resist composition. The present invention provides a chemically amplified resist composition comprising one or more kinds of amine compounds or amine oxide compounds (except for those having a nitrogen atom of amine or amine oxide included in a ring structure of an aromatic ring) at least having a carboxyl group and having no hydrogen atoms covalently bonded to a nitrogen atom as a basic center.
POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS
申请人:NISHI Tsunehiro
公开号:US20100062374A1
公开(公告)日:2010-03-11
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. The resin (A) is a polymer comprising recurring units containing a non-leaving hydroxyl group represented by formula (1) wherein R
1
is H, methyl or trifluoromethyl, X is a single bond or methylene, m is 1 or 2, and the hydroxyl group attaches to a secondary carbon atom. The composition is improved in resolution when processed by lithography.
NOVEL PHOTOACID GENERATOR, RESIST COMPOSITION, AND PATTERNING PROCESS
申请人:Ohsawa Youichi
公开号:US20090246694A1
公开(公告)日:2009-10-01
Photoacid generators generate sulfonic acids of formula (
1
a) upon exposure to high-energy radiation.
ROC(═O)R
1
—COOCH
2
CF
2
SO
3
−
H
+
(1a)
RO is OH or C
1
-C
20
organoxy, R
1
is a divalent C
1
-C
20
aliphatic group or forms a cyclic structure with RO. The photoacid generators are compatible with resins and can control acid diffusion and are thus suited for use in chemically amplified resist compositions.