申请人:Designer Molecules, Inc.
公开号:US20130199724A1
公开(公告)日:2013-08-08
The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.
本发明提供了环氧和氧杂环烷组合物,其中包括本文所述的新型酰氧基和N-酰基固化剂。使用本发明的固化剂可以得到固化粘合剂组合物,其粘附性显著增强,与使用其他类型固化剂固化的树脂相比,水亲和性降低。此外,本发明的固化剂不会干扰自由基固化,因此适用于混合固化热固性组合物。