申请人:SANYO CHEMICAL INDUSTRIES, LTD.
公开号:EP1375553A1
公开(公告)日:2004-01-02
The present invention uses a curable resin which has: in the molecule thereof, at least two crosslinking functional groups of at least one kind selected from the group consisting of epoxy group, (meth)acryloyl group, alkenylamino group and alkenyloxy group; a glass transition temperature before curing of 50 to 150°C; a weight-average molecular weight of 10,000 to 1,000,000; and a dielectric constant of not higher than 3.5 after curing. By use of the curable resin of the above constitution, the present invention can provide a curable resin that an insulator having an excellent thermal shock resistance and an excellent dielectric property is obtained.
本发明使用的可固化树脂具有:在其分子中,至少有两个交联官能团,这两个官能团至少选 自由环氧基、(甲基)丙烯酰基、烯酰氨基和烯酰氧基组成的组中的一种;固化前的玻璃化温度为 50 至 150°C;重量平均分子量为 10,000 至 1,000,000 ;以及固化后的介电常数不高于 3.5。通过使用上述构成的可固化树脂,本发明可以提供一种可固化树脂,从而获得具有优异抗热震性和优异介电性能的绝缘体。