PATTERNABLE LOW DIELECTRIC CONSTANT MATERIALS AND THEIR USE IN ULSI INTERCONNECTION
申请人:Lin Qinghuang
公开号:US20080063880A1
公开(公告)日:2008-03-13
The present invention relates to ultra-large scale integrated (ULSI) interconnect structures, and more particularly to patternable low dielectric constant (low-k) materials suitable for use in ULSI interconnect structures. The patternable low-k dielectrics disclosed herein are functionalized polymers that having one or more acid-sensitive imageable functional groups.
本发明涉及超大规模集成(ULSI)互连结构,更具体地涉及适用于ULSI互连结构的可图案化低介电常数(低-k)材料。本发明所披露的可图案化低-k介电材料是具有一种或多种酸敏感可成像功能基团的功能化聚合物。