5-(三氟甲基)苯-1,3-二羧酸 | 117186-03-5

• 物质功能分类: 有机原料 - 羧酸类化合物及衍生物
• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: 5-(三氟甲基)苯-1,3-二羧酸
• 中文别名: 5-三氟甲基-1,3-二苯甲酸
• 英文名称: 5-(trifluoromethyl)isophthalic acid
• 英文别名: 5-(Trifluoromethyl)benzene-1,3-dicarboxylic acid
• CAS: 117186-03-5
• 化学式: C₉H₅F₃O₄
• 分子量: 234.132
• InChiKey: MFRAUNNXQCRKQI-UHFFFAOYSA-N

物化性质

• 沸点：
  381.5±42.0 °C(Predicted)
• 密度：
  1.581±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.9
• 重原子数：
  16
• 可旋转键数：
  2
• 环数：
  1.0
• sp3杂化的碳原子比例：
  0.11
• 拓扑面积：
  74.6
• 氢给体数：
  2
• 氢受体数：
  7

安全信息

• 储存条件：
  存储条件：室温、干燥且密封。

反应信息

• 作为反应物：
  描述：

  5-(三氟甲基)苯-1,3-二羧酸 在 O-(1H-benzotriazol-1-yl)-N,N,N',N'-tetramethyluronium hexafluorophosphate 作用下， 以 氯仿 、 乙酸乙酯 、 二乙醇胺 、 N,N-二甲基甲酰胺 为溶剂， 反应 0.16h， 生成 N¹-[(2S,3R)-3-hydroxy-4-{[2-(3-methoxyphenyl)propan-2-yl]amino}-1-phenylbutan-2-yl]-N³,N³-dipropyl-5-(trifluoromethyl)isophthalamide
  参考文献：
  名称：

  拟肽纤溶酶抑制剂，具有强大的抗疟疾活性和对组织蛋白酶D的选择性

  摘要：

  继抗疟疾药物发现的公开倡议之后，开发了葛兰素史克（GSK）表型筛选命中物，以产生基于羟乙胺的纤溶酶（Plm）抑制剂，该抑制剂在纳摩尔浓度下显示出对疟原虫恶性疟原虫的生长抑制作用。进行了前导优化研究，目的是提高Plm抑制选择性与相关的人类天冬氨酸蛋白酶组织蛋白酶D（Cat D）。使用Plm IV作为易于获取的模型蛋白进行了优化研究，其抑制作用与抗疟活性有关。在Plms和Cat D的序列比对的指导下，诱导选择性的结构基序在羟乙基胺抑制剂的S3和S4子口袋中被取代。这导致有效的抗疟疾药具有高达50倍的Plm IV / Cat D选择性因子。对所选化合物作用机理的更详细研究表明，它们抑制恶性疟原虫的成熟。枯草杆菌蛋白酶样蛋白酶SUB1，并且还抑制寄生虫从红细胞中流出。我们的结果表明，该化合物的抗疟疾活性与SUB1成熟酶纤溶酶亚型Plm X的抑制作用有关。

  DOI：

  10.1016/j.ejmech.2018.11.068

文献信息

• Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device
  申请人：——

  公开号：US20020013443A1

  公开（公告）日：2002-01-31

  A precursor of a polybenzoxazole resin which comprises a crosslinking group in a molecule and has a specific structure, a polybenzoxazole resin obtained from the precursor by the condensation reaction and the crosslinking reaction, an insulating film comprising the polybenzoxazole resin and a semiconductor device comprising an insulating interlayer film in multi-layer wiring or a film for protecting surfaces which comprises the above insulating film. The precursor exhibits excellent processability due to excellent solubility in solvents and, after the ring closure, excellent heat stability in applications. The resin exhibits excellent electric, physical and mechanical properties and is advantageously used for insulating interlayer films of semiconductor devices and the like applications.

  一种聚苯并咪唑树脂的前体，其分子中包含交联基团并具有特定的结构，通过缩合反应和交联反应获得的聚苯并咪唑树脂，包括聚苯并咪唑树脂的绝缘膜以及包括上述绝缘膜的多层布线中的绝缘中间层膜或用于保护表面的膜的半导体器件。由于前体在溶剂中具有优异的溶解性，因此表现出优异的加工性能，并且在环闭后具有优异的热稳定性能，树脂表现出优异的电学、物理和机械性能，可优点地用于半导体器件的绝缘中间层膜等应用。
• Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same
  申请人：——

  公开号：US20040002572A1

  公开（公告）日：2004-01-01

  A material for an insulating film which comprises a copolymer obtained by reacting a polyamide having a specific structure and a reactive oligomer as a component forming the film; a coating varnish for an insulating film which comprises this material and an organic solvent; an insulating film which comprises a layer of a resin comprising as a main structure a polybenzoxazole which is obtained by treating the above material or the above coating varnish by heating so that condensation reaction and crosslinking reaction take place and has fine pores; and a semiconductor device which comprises an insulating interlayer film for multi-layer wiring comprising the insulating film and/or a surface protective film comprising the insulating film. Excellent electrical, thermal and mechanical properties are exhibited and a low permittivity can be achieved.

  一种绝缘薄膜材料，包括由特定结构的聚酰胺和反应性低聚物作为成膜组分所反应得到的共聚物；一种用于绝缘薄膜的涂覆清漆，包括该材料和有机溶剂；一种绝缘薄膜，包括一层树脂，其主要结构为通过热处理上述材料或上述涂覆清漆得到的聚苯并咪唑，发生缩聚反应和交联反应并具有细小孔隙；以及一种半导体器件，包括用于多层布线的绝缘中间层膜，包括上述绝缘薄膜和/或表面保护膜，包括上述绝缘薄膜。具有优异的电性能、热性能和机械性能，并且可以实现低介电常数。
• HEAT-RESISTANT RESIN PRECURSOR, HEAT-RESISTANT RESIN AND INSULATING FILM AND SEMICONDUCTOR DEVICE
  申请人：SUMITOMO BAKELITE CO., LTD.

  公开号：EP1327653A1

  公开（公告）日：2003-07-16

  A precursor of a polybenzoxazole resin which comprises a crosslinking group in a molecule and has a specific structure, a polybenzoxazole resin obtained from the precursor by the condensation reaction and the crosslinking reaction, an insulating film comprising the polybenzoxazole resin and a semiconductor device comprising an insulating interlayer film in multi-layer wiring or a film for protecting surfaces which comprises the above insulating film. The precursor exhibits excellent processability due to excellent solubility in solvents and, after the ring closure, excellent heat stability in applications. The resin exhibits excellent electric, physical and mechanical properties and is advantageously used for insulating interlayer films of semiconductor devices and the like applications.

  一种在分子中含有交联基团并具有特定结构的聚苯并恶唑树脂前体，一种由该前体通过缩合反应和交联反应得到的聚苯并恶唑树脂，一种由该聚苯并恶唑树脂组成的绝缘膜，以及一种由多层布线中的绝缘夹层膜或由上述绝缘膜组成的表面保护膜组成的半导体器件。前体在溶剂中具有极佳的溶解性，因此具有极佳的加工性，并且在闭环后具有极佳的热稳定性。该树脂具有优异的电气、物理和机械性能，可用于半导体设备的绝缘夹层薄膜和类似用途。
• BIS(3-AMINO-4-HYDROXYPHENYL)ADAMANTANE DERIVATIVES AND PROCESS FOR PRODUCTION THEREOF
  申请人：IDEMITSU KOSAN COMPANY LIMITED

  公开号：EP1602641A1

  公开（公告）日：2005-12-07

  The invention provides compounds which are excellent in terms of heat resistance, mechanical characteristics, electric characteristics, physical properties, etc. and which provide a novel material useful for, for example, interlayer insulating film or protective film for use in semiconductor devices, interlayer insulating film for use in multilayer wiring boards, cover coating in flexible printed circuits, or a liquid crystal alignment layer. The compounds are bis(3-amino-4-hydroxyphenyl)adamantane derivatives having a structure represented by formula (I) or (II): (each of R1 to R4 represents a halogen atom, a hydroxyl group, an alkyl group, an alkoxyl group, a carboxyl group, or an alkoxycarbonyl group, each of m and a is an integer of 0 to 3, and each of n and b is an integer of 0 to 14, with the proviso that the case where the following three conditions in formula (I) are met is excluded: R2 is methyl and present at a bridgehead; m is 0; and n is 2).

  本发明提供的化合物在耐热性、机械特性、电气特性、物理性能等方面具有优异的性能，并提供了一种新型材料，可用于例如半导体器件中使用的层间绝缘膜或保护膜、多层线路板中使用的层间绝缘膜、柔性印刷电路中的覆盖涂层或液晶配向层。 这些化合物是双(3-氨基-4-羟基苯基)金刚烷衍生物，其结构由式(I)或(II)表示： (R1至R4各自代表卤素原子、羟基、烷基、烷氧基、羧基或烷氧基羰基，m和a各自为0至3的整数，n和b各自为0至14的整数，但不包括满足式（I）中以下三个条件的情况：R2为甲基且存在于桥头；m为0；n为2）。
• RESIN AND RESIN COMPOSITION
  申请人：Asahi Kasei EMD Corporation

  公开号：EP1707588A1

  公开（公告）日：2006-10-04

  Disclosed is a hydroxy polyamide represented by the following general formula (1) and having a 5-amino isophthalic acid derivative structure in the main chain structure. (1) (In the formula, m and n represent integers, X represents at least one tetravalent organic group, Y represents at least one divalent organic group having a 5-amino isophthalic acid derivative structure, and Z represents at least one divalent organic group.)

  所公开的羟基聚酰胺由以下通式(1)表示，在主链结构中具有 5-氨基间苯二甲酸衍生物结构。(1) （式中，m 和 n 代表整数，X 代表至少一个四价有机基团，Y 代表至少一个具有 5-氨基间苯二甲酸衍生物结构的二价有机基团，Z 代表至少一个二价有机基团）。