N,N'-(4-甲基-1,3-亚苯基)二(1-吡咯烷甲酰胺) | 60006-11-3

• 物质功能分类: 有机原料 - 氨基化合物 - 酰胺类化合物
• 分子结构分类: 有机化合物 - 苯类化合物 - 苯和取代衍生物
• 中文名称: N,N'-(4-甲基-1,3-亚苯基)二(1-吡咯烷甲酰胺)
• 英文名称: 1-Pyrrolidinecarboxamide, N,N'-(4-methyl-1,3-phenylene)bis-
• 英文别名: N-[4-methyl-3-(pyrrolidine-1-carbonylamino)phenyl]pyrrolidine-1-carboxamide
• CAS: 60006-11-3
• 化学式: C₁₇H₂₄N₄O₂
• 分子量: 316.4
• InChiKey: GXNHWSRZOJJZKB-UHFFFAOYSA-N

物化性质

• 沸点：
  589.8±50.0 °C(Predicted)
• 密度：
  1.298±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  1.6
• 重原子数：
  23
• 可旋转键数：
  2
• 环数：
  3.0
• sp3杂化的碳原子比例：
  0.53
• 拓扑面积：
  64.7
• 氢给体数：
  2
• 氢受体数：
  2

文献信息

• ONE-COMPONENT EPOXY RESIN COMPOSITION
  申请人：Ajinomoto Co., Inc.

  公开号：EP1707585A1

  公开（公告）日：2006-10-04

  The present application discloses a one-component epoxy resin composition, characterized by containing an epoxy resin having 2 or more epoxy groups in the molecule (component (1)), a polythiol compound having 2 or more thiol groups in the molecule (component (2)), a compound that releases a basic component under a curing temperature condition and dissolves in the above component (2) (component (3)), and a compound having Lewis acidity (component (4)). This composition is a reproducible and practical one-component epoxy resin composition containing an epoxy resin and a curing agent that are uniformly mixed, having greatly improved, sufficient storage stability, and further having excellent curing properties, and by this composition, an excellent method enabling impregnating adhesion and thin film curing, and functional products can be provided.

  本申请公开了一种单组分环氧树脂组合物，其特征在于含有分子中含有 2 个或 2 个以上环氧基团的环氧树脂（组分(1)）、分子中含有 2 个或 2 个以上硫醇基团的聚硫醇化合物（组分(2)）、在固化温度条件下释放碱性组分并溶解于上述组分(2)的化合物（组分(3)）以及具有路易斯酸性的化合物（组分(4)）。该组合物是一种可再现的实用单组分环氧树脂组合物，其中含有混合均匀的环氧树脂和固化剂，具有极大的改善和足够的储存稳定性，并进一步具有优异的固化性能，通过该组合物，可以提供一种实现浸渍粘合和薄膜固化的优异方法和功能性产品。
• SILVER COATED FLAKY MATERIAL FILLED CONDUCTIVE CURABLE COMPOSITION AND THE APPLICATION IN DIE ATTACH
  申请人：Henkel Corporation

  公开号：EP2297262A1

  公开（公告）日：2011-03-23
• One-component epoxy resin composition
  申请人：Amano Hiroshi

  公开号：US20070021582A1

  公开（公告）日：2007-01-25

  The present application relates to a one-component epoxy resin composition that contains an epoxy resin containing: (1) an epoxy resin having 2 or more epoxy groups in the molecule, (2) a polythiol compound having 2 or more thiol groups in the molecule, (3) a compound that releases a basic component under a curing temperature condition and dissolves in constituent (2), and (4) a compound having Lewis acidity. The present invention also relates to a method of producing the same.
• CURABLE ADHESIVE COMPOSITION FOR DIE ATTACH
  申请人：Henkel AG & Co. KGaA

  公开号：US20210062047A1

  公开（公告）日：2021-03-04

  This invention relates to a curable adhesive composition. In particular, the present invention relates to a curable adhesive composition for die attach, which eliminates the void issue, minimizes the fillet, and has lower bond line thickness and tilt trend, when cured.
• US7479534B2
  申请人：——

  公开号：US7479534B2

  公开（公告）日：2009-01-20