4-[1,3-Dihydroxy-1-(4-hydroxy-3-methoxyphenyl)propan-2-yl]oxy-3-methoxybenzoic acid

• 分子结构分类: 有机化合物 - 木脂素、新木脂素和相关化合物
• 英文名称: 4-[1,3-Dihydroxy-1-(4-hydroxy-3-methoxyphenyl)propan-2-yl]oxy-3-methoxybenzoic acid
• 化学式: C₁₈H₂₀O₈
• 分子量: 364.3
• InChiKey: UDFDXTXZIMXARD-UHFFFAOYSA-N

计算性质

• 辛醇/水分配系数(LogP)：
  1.2
• 重原子数：
  26
• 可旋转键数：
  8
• 环数：
  2.0
• sp3杂化的碳原子比例：
  0.28
• 拓扑面积：
  126
• 氢给体数：
  4
• 氢受体数：
  8

反应信息

• 作为反应物：
  描述：

  4-[1,3-Dihydroxy-1-(4-hydroxy-3-methoxyphenyl)propan-2-yl]oxy-3-methoxybenzoic acid 生成 甲氧苯醌
  参考文献：
  名称：

  CEMEHOBA, E. I., SB. TR.,(1988) N7, S. 74-82

  摘要：

  DOI：
• 作为产物：
  描述：

  (E)-3-[4-[1,3-dihydroxy-1-(4-hydroxy-3-methoxyphenyl)propan-2-yl]oxy-3-methoxyphenyl]prop-2-enoic acid 生成 4-[1,3-Dihydroxy-1-(4-hydroxy-3-methoxyphenyl)propan-2-yl]oxy-3-methoxybenzoic acid
  参考文献：
  名称：

  CEMEHOBA, E. I., SB. TR.,(1988) N7, S. 74-82

  摘要：

  DOI：

文献信息

• KATAYAMA, TAKESHI;SOGO, MURAO;HIGUCHI, TAKAYOSHI, HOLZFORSCHUNG, 1986, 40, N 3, 175-182
  作者：KATAYAMA, TAKESHI、SOGO, MURAO、HIGUCHI, TAKAYOSHI

  DOI：——

  日期：——
• Resin composition, resin molding product, production method of resin molding product and recycling method of resin molding product
  申请人：Yao Kenji

  公开号：US20080051507A1

  公开（公告）日：2008-02-28

  A resin composition is provided and includes a copolymer having a structure represented by formula (I) and a structure represented by formula (II). In the formulae, X 1 and X 2 each independently represent a hydrogen atom, a hydroxyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, or a substituted or unsubstituted alkoxy group; X 3 and X 4 each independently represent a hydroxyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted alkoxy group, or a substituted or unsubstituted alkoxycarbonyl group; a and b each independently are an integer of from 1 to 4, and n is an integer of from 1 to 10, and R 1 represents a linear or branched alkylene group; and m is an integer of 10 or more.
• US7598319B2
  申请人：——

  公开号：US7598319B2

  公开（公告）日：2009-10-06