NOVEL NITRILE AND AMIDOXIME COMPOUNDS AND METHODS OF PREPARATION
申请人:Lee Wai Mun
公开号:US20090111965A1
公开(公告)日:2009-04-30
The present application relates to semiconductor processing compositions comprising at least one compound containing at least one amidoxime functional group and to methods of using these compositions in semiconductor processing. The present application also describes the preparation of amidoximes for a semiconductor processing composition by (a) mixing a cyanoethylation catalyst, a nucleophile and an alpha-unsaturated nitrile to produce a cyanoethylation product; and (b) converting a cyano group in the cyanoethylation product into an amidoxime functional group.
New 1,2,4‐oxadiazole/pyrrolidine hybrids as topoisomerase IV and DNA gyrase inhibitors with promising antibacterial activity
作者:Firas O. A. Frejat、Yaquan Cao、Lihong Wang、Hongjin Zhai、Ahmed H. Abdelazeem、Hesham A. M. Gomaa、Bahaa G. M. Youssif、Chunli Wu
DOI:10.1002/ardp.202100516
日期:2022.7
effective molecules against the enzymes DNA gyrase and topoisomeraseIV (Topo IV). Compounds 8–20 were developed based on a previously disclosed series of compounds from our lab, but with small structural modifications in the hopes of increasing the compounds' biological activity. In comparison to novobiocin, with IC50 = 170 nM, the findings of the DNA gyrase inhibitory assay revealed that compounds 16
CHEMICAL MECHANICAL POLISHING AND WAFER CLEANING COMPOSITION COMPRISING AMIDOXIME COMPOUNDS AND ASSOCIATED METHOD FOR USE
申请人:Lee Wai Mun
公开号:US20090130849A1
公开(公告)日:2009-05-21
A composition and associated method for chemical mechanical planarization (or other polishing) is described. The composition contains an amidoxime compound and water. The composition may also contain an abrasive and a compound with oxidation and reduction potential. The composition is useful for attaining improved removal rates for metal, including copper, barrier material, and dielectric layer materials in metal CMP. The composition is particularly useful in conjunction with the associated method for metal CMP applications.
METHODS OF CLEANING SEMICONDUCTOR DEVICES AT THE BACK END OF LINE USING AMIDOXIME COMOSITIONS
申请人:Lee Wai Mun
公开号:US20100043823A1
公开(公告)日:2010-02-25
The present invention relates to aqueous compositions comprising amidoxime compounds and methods for cleaning plasma etch residue from semiconductor substrates including such dilute aqueous solutions. The compositions of the invention may optionally contain one or more other acid compounds, one or more basic compounds, and a fluoride-containing compound and additional components such as organic solvents, chelating agents, amines, and surfactants. The invention also relates to a method of removing residue from a substrate during integrated circuit fabrication.