1,1-bis-[2-(2-hydroxy-ethoxy)-ethoxy]-ethane | 78706-58-8

• 分子结构分类: 有机化合物 - 有机氧化合物
• 英文名称: 1,1-bis-[2-(2-hydroxy-ethoxy)-ethoxy]-ethane
• 英文别名: 1,1-Bis-[2-(2-hydroxy-aethoxy)-aethoxy]-aethan；Aethyliden-bis-diaethylenglykol；2-[2-[1-[2-(2-Hydroxyethoxy)ethoxy]ethoxy]ethoxy]ethanol；2-[2-[1-[2-(2-hydroxyethoxy)ethoxy]ethoxy]ethoxy]ethanol
• CAS: 78706-58-8
• 化学式: C₁₀H₂₂O₆
• 分子量: 238.281
• InChiKey: XWMOYODWBFNKBH-UHFFFAOYSA-N

物化性质

• 沸点：
  350.0±32.0 °C(Predicted)
• 密度：
  1.111±0.06 g/cm3(Predicted)

计算性质

• 辛醇/水分配系数(LogP)：
  -1.2
• 重原子数：
  16
• 可旋转键数：
  12
• 环数：
  0.0
• sp3杂化的碳原子比例：
  1.0
• 拓扑面积：
  77.4
• 氢给体数：
  2
• 氢受体数：
  6

反应信息

• 作为产物：
  描述：

  乙酸乙烯酯 、 二乙二醇 在 boron trifluoride methanol complex 、 mercury(II) oxide 作用下， 生成 1,1-bis-[2-(2-hydroxy-ethoxy)-ethoxy]-ethane
  参考文献：
  名称：

  Preparation of acetal bodies from polyhydric alcohols

  摘要：

  公开号：

  US02447975A1

文献信息

• BLOCK COPOLYMERS
  申请人：NYCOMED IMAGING AS

  公开号：EP0748226A1

  公开（公告）日：1996-12-18
• METHOD FOR CLEANING AND DRYING SEMICONDUCTOR SUBSTRATE
  申请人：SHIN-ETSU CHEMICAL CO., LTD.

  公开号：US20150221500A1

  公开（公告）日：2015-08-06

  The present invention provides a method for cleaning and drying a semiconductor substrate in which a semiconductor substrate onto which a pattern has been formed is cleaned and dried, which comprises steps of (1) cleaning the semiconductor substrate onto which a pattern has been formed with a cleaning solution, (2) substituting the cleaning solution with a composition solution containing a resin (A) which is decomposed by either or both of an acid and heat, and (3) decomposing and removing the resin (A) by either or both of an acid and heat. There can be provided a method for cleaning and drying a semiconductor substrate in which pattern falling or collapse occurring at the time of drying the cleaning solution after cleaning the substrate can be suppressed, and the cleaning solution can be efficiently removed, without using a specific apparatus which handles a supercritical state cleaning solution.
• US5618528A
  申请人：——

  公开号：US5618528A

  公开（公告）日：1997-04-08
• US5853713A
  申请人：——

  公开号：US5853713A

  公开（公告）日：1998-12-29
• US9524863B2
  申请人：——

  公开号：US9524863B2

  公开（公告）日：2016-12-20