A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance.
The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature.
The thermosetting resin composition comprises:
(A) an epoxy resin (component A); and
(B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group and represented by the following formula (B-i) in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure:
(wherein Q is bivalent to tetravalent bond group which is an aliphatic group, alicyclic group, aromatic group, or a combination of these groups and may contain a hetero atom or substituent); and/or
(b) a polyvalent amine-based curing agent (component b) represented by the following formula (b-i):
(wherein Ar1 to Ar4 are each independently a phenylene group or naphthalene-diyl group which may be substituted by a substituent).
一种热固性
树脂组合物,即使在使用碳二
亚胺化合物时也不会产生游离
异氰酸酯,并能提供一种具有高耐热性的固化
树脂。
这种热固性
树脂组合物可以降低固化温度,在短时间内固化,并提供具有高
玻璃化转变温度的固化
树脂。
热固性
树脂组合物包括
(A) 环氧
树脂(成分 A);以及
(B) 环状碳二
亚胺化合物(组分 B),包括具有一个碳二
亚胺基团的环状结构,由 下式(B-i)表示,其中第一氮和第二氮通过一个键基结合在一起,并具有 8 至 50 个原子形成环状结构:
(其中 Q 为二价至四价键基,它是脂肪族基团、脂环族基团、芳香族基团或这些基团的组合,并可含有杂原子或取代基);和/或
(b) 由下式(b-i)表示的多价胺基固化剂(组分 b):
(其中 Ar1 至 Ar4 各自独立地为可被取代基取代的亚苯基或
萘二基)。