十个带有各种取代基的氧杂环丁烷在氯化烃溶剂中与N 2 O 5反应,生成1,3-二硬脂酸酯(I)通过开环硝化作用。衍生自在2-位未被取代的氧杂环丁烷的二/三硝酸盐的产率为73-88%,而带有此类取代基的氧杂环丁烷的产率为15-21%。虽然带有非羟基取代基(环氧(环氧乙烷基),螺-氧杂环丁烷和烯烃)的氧杂环丁烷的选择性环裂解是不可能的,但通常来说,在用于产生可用作前体的硝基-甲基氧杂环丁烷的条件下,可以实现羟烷基氧杂环丁烷的选择性硝化。高能聚醚。与代表性环氧化物的半定量反应性比较表明,氧杂环丁烷对N 2 O 5的反应性较低,这是由于其较低的环应变所预期的。
十个带有各种取代基的氧杂环丁烷在氯化烃溶剂中与N 2 O 5反应,生成1,3-二硬脂酸酯(I)通过开环硝化作用。衍生自在2-位未被取代的氧杂环丁烷的二/三硝酸盐的产率为73-88%,而带有此类取代基的氧杂环丁烷的产率为15-21%。虽然带有非羟基取代基(环氧(环氧乙烷基),螺-氧杂环丁烷和烯烃)的氧杂环丁烷的选择性环裂解是不可能的,但通常来说,在用于产生可用作前体的硝基-甲基氧杂环丁烷的条件下,可以实现羟烷基氧杂环丁烷的选择性硝化。高能聚醚。与代表性环氧化物的半定量反应性比较表明,氧杂环丁烷对N 2 O 5的反应性较低,这是由于其较低的环应变所预期的。
METAL ALKOXIDE COMPOUND, THIN-FILM-FORMING MATERIAL, METHOD FOR PRODUCING THIN FILM, AND ALCOHOL COMPOUND
申请人:ADEKA CORPORATION
公开号:US20150175642A1
公开(公告)日:2015-06-25
Disclosed is a metal alkoxide compound having physical properties suitable for a material for forming thin films by CVD, and particularly, a metal alkoxide compound having physical properties suitable for a material for forming metallic-copper thin films. A metal alkoxide compound is represented by general formula (I). A thin-film-forming material including the metal alkoxide compound is described as well. (In the formula, R
1
represents a methyl group or an ethyl group, R
2
represents a hydrogen atom or a methyl group, R
3
represents a C
1-3
linear or branched alkyl group, M represents a metal atom or a silicon atom, and n represents the valence of the metal atom or silicon atom.
ORGANOMETALLIC COMPOUND AND METHOD OF MANUFACTURING INTEGRATED CIRCUIT USING THE SAME
申请人:SAMSUNG ELECTRONICS CO., LTD.
公开号:US20210388010A1
公开(公告)日:2021-12-16
An organometallic compound and a method of manufacturing an integrated circuit (IC) device, the organometallic compound being represented by Formula (I),
一种有机金属化合物和一种制造集成电路(IC)器件的方法,该有机金属化合物由式(I)表示,
Compound, thin film-forming material, and thin film manufacturing method
申请人:ADEKA CORPORATION
公开号:US10253408B2
公开(公告)日:2019-04-09
A novel compound represented by the general formula (I) or (II) below:
[in the formula, each of R1 and R2 independently represent a C1˜12 hydrocarbon group, and Si(R3)3 is optionally substituted for a hydrogen atom in the hydrocarbon group; however, R1 and R2 are different groups; R3 represents a methyl or ethyl group; M represents a metal atom or silicon atom; and n is an integer from 1 to 4].
ALUMINUM COMPOUND AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
申请人:Samsung Electronics Co., Ltd.
公开号:US20200207790A1
公开(公告)日:2020-07-02
Provided are an aluminum compound and a method for manufacturing a semiconductor device using the same. The aluminum compound may be represented by Formula 1.
提供了一种铝化合物以及使用它制造半导体器件的方法。该铝化合物可用公式1表示。
ALKOXIDE COMPOUND, RAW MATERIAL FOR FORMING THIN FILM, METHOD FOR MANUFACTURING THIN FILM, AND ALCOHOL COMPOUND
申请人:ADEKA CORPORATION
公开号:US20170121358A1
公开(公告)日:2017-05-04
An alkoxide compound is represented by General Formula (I) below:
wherein R
1
to R
3
each independently represent hydrogen, a C
1-12
hydrocarbon group, etc.; R
4
represents a C
1-12
hydrocarbon group, etc.; L represents hydrogen, halogen, a hydroxyl group, an amino group, an azi group, a phosphido group, a nitrile group, a carbonyl group, a C
1-12
hydrocarbon group, etc.; and M represents a metal atom or a silicon atom, n represents an integer of 1 or more, m represents an integer of 0 or more, and n+m represents the valence of the metal atom or silicon atom.