申请人:FUJITSU LIMITED
公开号:EP0453237A2
公开(公告)日:1991-10-23
The film forming, photosensitive, heat-resistant resin composition comprising a varnish of a polyimide precursor having no photosensitivity in itself, a polymerizable monomer or oligomer compatible with said varnish and capable of providing a high-heat-resistant polymer upon being polymerized and a polymerization initiator for said monomer or oligomer. The resin composition is useful for the production of circuit substrates and semiconductor devices for high-density mounting including multi-chip modules or the like, such as printed circuits, printed boards, wiring boards and electronic components, can effectively avoid a reduction of the layer thickness during the film formation, and ensures a low cost production process. The pattern formation process using the same resin composition is also disclosed.
成膜、感光、耐热树脂组合物,包括本身无感光性的聚酰亚胺前体清漆、与所述清漆相容且聚合后能形成高耐热聚合物的可聚合单体或低聚物以及所述单体或低聚物的聚合引发剂。该树脂组合物适用于生产电路基板和高密度安装的半导体器件,包括多芯片模块或类似器件,如印刷电路、印刷板、配线板和电子元件,可有效避免在成膜过程中减少层厚度,并确保低成本生产工艺。此外,还公开了使用相同树脂组合物的图案形成工艺。