High ortho-ortho bonded novolak binder resins and their use in radiation-sensitive compositions
申请人:OCG MICROELECTRONIC MATERIALS, INC.
公开号:EP0623633A2
公开(公告)日:1994-11-09
A phenolic novolak composition prepared by a process characterized by the steps of:
(1) reacting a first phenolic monomer comprising a major portion of at least one trifunctional phenolic monomer with a first aldehyde source in the absence of a catalyst at a reaction temperature from about 100°C to about 200°C and at a reaction pressure of about 2 to about 15 atmospheres to form a phenolic oligomer having a weight average molecular weight from about 500 to about 2,000, having ortho-ortho bonding of about 55% to about 75% of the methylene bonds between the phenolic moieties; and having a time to clear of less than 125 seconds per micron; wherein the mole ratio of said first aldehyde source to said first phenolic monomer is from about 0.3:1.0 to about 0.55:1.0; and
(2) then reacting said oligomer with an optional second phenolic source and a second aldehyde source at a temperature from about 80°C to about 150°C to form a phenolic novolak having a weight average molecular weight of 3,000 to 40,000, having ortho-ortho bonding of between 50% and 70% of the methylene bonds between the phenolic moieties, and having a time to clear of at least 20 seconds per micron; wherein the mole ratio of said second aldehyde source to said total phenolic moieties is less than about 0.8:1.0.
一种酚醛树脂组合物,其制备过程包括以下步骤
(1) 在没有催化剂的情况下,在反应温度约为 100°C 至约 200°C,反应压力约为 2 至约 15 个大气压的条件下,使包含至少一种三官能酚类单体的主要部分的第一酚类单体与第一醛源反应,以形成酚类低聚物,该酚类低聚物的重量平均分子量约为 500 至约 2,000,酚基之间的亚甲基键的正交键合率约为 55% 至约 75%;其中所述第一醛源与所述第一酚单体的摩尔比为约 0.3:1.0至约0.55:1.0;以及
(2) 然后将所述低聚物与任选的第二酚源和第二醛源在约80℃至约150℃的温度下反应,以形成酚醛新酯,其重量平均分子量为3,000至40,000,酚基之间50%至70%的亚甲基键为正交键,且每微米的透明时间至少为20秒;其中所述第二醛源与所述酚基总量的摩尔比小于约0.8:1.0。