Disclosed is a photosensitive novolac resin including a structural unit represented by the following Chemical Formula 1 and structural unit represented by the following Chemical Formula 2, wherein R
11
, R
12
, R
13
, and R
14
in Chemical Formulae 1 and 2 are the same as defined in the detailed description, a positive photosensitive resin composition including the same, a photosensitive resin film fabricated using the same, and a semiconductor device including the photosensitive resin composition.
本发明公开了一种光敏性新乐酸
树脂,其中包括由以下
化学式1表示的结构单元和由以下
化学式2表示的结构单元,其中
化学式1和2中的R11,R12,R13和R14与详细描述中定义的相同,以及包括该
树脂的正向光敏
树脂组合物,使用该组合物制造的光敏
树脂膜,以及包括该光敏
树脂组合物的半导体器件。