New photosensitive polyamic acid precursors are disclosed which have the formula:
where Z is a tetravalent organic radical which contains at least one aromatic ring, Z' is a divalent organic radical which contains at least one aromatic ring, and R* is a photosensitive group. Particularly preferred compounds include BPDA-PDA and BPDA-ODA polyamic acid precursors. The precursor compositions within the practice of this invention are i-line, g-line, and i-/g-line active and show good photoresolution. The films formed exhibit excellent self-adhesion and adhesion to glass ceramic and silicon wafer substrates have low internal stress, a very low degree of solvent swelling, high thermal stability, and excellent mechanical properties such as high modulus/tensile strength and high elongation at break.
本发明公开了具有以下式子的新型光敏聚酰胺酸前体:
其中 Z 是含有至少一个芳香环的四价有机基,Z' 是含有至少一个芳香环的二价有机基,R* 是光敏基团。特别优选的化合物包括
BPDA-
PDA 和
BPDA-
ODA 聚酰胺前体。本发明的前体组合物具有 i 线、g 线和 i/g 线活性,并显示出良好的光分辨率。所形成的薄膜在
玻璃陶瓷和
硅晶片基底上具有极佳的自粘性和附着性,内应力低,溶剂溶胀程度极低,热稳定性高,机械性能优异,如模量/拉伸强度高,断裂伸长率高。