PHOTOPOLYMERIZABLE COMPOSITION AND PHOTOPOLYMERIZABLE ELEMENT
申请人:HITACHI CHEMICAL CO., LTD.
公开号:EP0503076A1
公开(公告)日:1992-09-16
A photopolymerizable composition comprising 100 parts by weight of a compound having at least one ethylenically unsaturated group, 0 to 400 parts by weight of a thermoplastic organic polymer and 0.01 to 20 parts by weight of a photopolymerization initiator comprising an acridine compound represented by general formula (I), and a photopolymerizable element comprising a support and, formed thereon, a layer of said composition, wherein R represents C₂ to C₂₀ alkylene, oxadialkylene or thiadialkylene.
A photosensitive resin composition comprising a (A) binder polymer, a (B) photopolymerizing compound having ethylenic unsaturated bonds in the molecule, a (C) photopolymerization initiator and a (D) polymerization inhibitor, wherein the (C) photopolymerization initiator comprises an acridine compound, and the content of the (D) polymerization inhibitor is 20-100 ppm by weight.
Photosensitive element, laminate, permanent mask resist, method for producing same, and method for producing semiconductor package
申请人:HITACHI CHEMICAL COMPANY, LTD.
公开号:US11054744B2
公开(公告)日:2021-07-06
Provided is a photosensitive element including a support film, and a photosensitive layer provided on the support film and formed from a photosensitive resin composition, in which the surface roughness of the surface of the support film that is in contact with the photosensitive layer is 200 to 4,000 nm.