The present invention relates to thermally curable adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The thermally curable adhesives comprise at least one thermosetting resin, electrically conductive particles having an average particle size of 1 μm to 50 μm, and at least one metal precursor, wherein the metal precursor decomposes substantially to the corresponding metal during the thermal curing of the thermally curable adhesive.
本发明涉及适用于制造电子设备、集成电路、半导体器件、被动元件、太阳能电池、太阳能模块和/或发光二极管的导电材料的热固化粘合剂。热固化粘合剂包括至少一种热固性
树脂、平均粒径为 1 μm 至 50 μm 的导电颗粒和至少一种
金属前体,其中
金属前体在热固化粘合剂的热固化过程中基本上分解成相应的
金属。