Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
申请人:HITACHI CHEMICAL COMPANY, LTD.
公开号:US10251265B2
公开(公告)日:2019-04-02
The present invention provides the prepreg being formed by impregnating a fiber base material with a resin composition and the resin composition comprising an acrylic resin, wherein the ratio of the peak height near 2240 cm−1 due to nitrile groups (PCN) with respect to the peak height near 1730 cm−1 due to carbonyl groups (PCO) in the IR spectrum of the cured resin composition (PCN/PCO) is no greater than 0.001 and the like in order to provide a prepreg, a film with a resin, a metal foil with a resin and a metal-clad laminate, which exhibit excellent bending resistance while also prevent ion migration and have excellent insulating reliability when printed wiring boards are fabricated, as well as a printed wiring board employing the same.
本发明提供了通过用树脂组合物浸渍纤维基材料而形成的预浸料,该树脂组合物包括丙烯酸树脂,其中固化树脂组合物红外光谱中 2240 cm-1 附近的腈基(PCN)峰高与 1730 cm-1 附近的羰基(PCO)峰高之比(PCN/PCO)不大于 0。001 等,以提供一种预浸料、一种含树脂的薄膜、一种含树脂的金属箔和一种金属包覆层压板,它们具有优异的抗弯曲性,同时还能防止离子迁移,并在制造印刷线路板时具有优异的绝缘可靠性,以及一种采用上述材料的印刷线路板。