申请人:——
公开号:US20020151659A1
公开(公告)日:2002-10-17
The present invention is to provide a resin composition excellent in moisture absorption property, heat resistance, adhesive property and electric characteristics, and excellent in molding property, and suitable for an insulating material such as a multilayer wiring substrate, electronic parts, etc., and an adhesive film.
There is disclosed a resin composition comprising (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6′-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4′-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, etc., and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-male-imidophenoxy)phenyl)propane, etc.
本发明旨在提供一种吸湿性、耐热性、粘合性和电气特性优良,成型性优良,适用于多层配线基板、电子零件等绝缘材料和粘合膜的树脂组合物。
本发明公开了一种树脂组合物,它包含(A)含有结构式(1)代表的喹啉环的聚合物,如 6,6′-双(2-(4-氟苯基)-4-苯基喹啉)和 4,4′-(1,1,1,3,3,3-六氟-2,2-亚丙基)双酚等、(B) 由式 (2) 表示的双马来酰亚胺化合物,如 2,2-双((4-马来酰亚胺基苯氧基)苯基)丙烷等。