The present invention relates to compounds according to formula (I) and to heat-curable compositions based on polymaleimide resin systems comprising such compounds as co-monomers: wherein R1 is hydrogen or an alkenylphenoxy group, R2 is an alkenylphenoxy group, and R3 is hydrogen or an alkyl group with 1 to 4 carbon atoms. The present invention also relates to crosslinked resins obtainable by curing such compositions. Compounds of the present invention can be used amongst others in fields like structural adhesives, matrix resins for fiber prepregs, moulding compounds, as well as structural and/or electrical composites.
本发明涉及根据式(I)的化合物以及基于聚马来
酰亚胺树脂体系的热固性组合物,其中这些化合物作为共聚单体:其中R1是氢或烯基苯氧基,R2是烯基苯氧基,R3是氢或具有1至4个碳原子的烷基基团。本发明还涉及通过固化这种组合物获得的交联
树脂。本发明的化合物可以在结构粘合剂、纤维预浸料的基质
树脂、成型复合材料以及结构和/或电气复合材料等领域中使用。